Method for fabricating a structure for a microelectromechanical system (MEMS) device
First Claim
Patent Images
1. A method of fabricating a microelectromechanical system device, comprising:
- forming a first conductive layer on a substrate;
depositing at least one first layer on the first conductive layer;
patterning said first layer to define at least a first portion of said microelectromechanical system device;
depositing a second layer on said first layer, wherein the second layer comprises a negative-acting photoresist;
patterning said second layer using said first layer as a photomask;
developing said second layer to form a plurality of a supports of the microelectromechanical system device; and
forming a structural layer over the supports.
4 Assignments
0 Petitions
Accused Products
Abstract
The invention provides a microfabrication process which may be used to manufacture a MEMS device. In one embodiment, the process comprises depositing at least one first layer on a substrate. The process further comprises patterning said first layer to define at least a first portion of said microelectromechanical system device. The process further comprises depositing a second layer on said first layer. The process further comprises patterning said second layer using said first layer as a photomask. The process further comprises developing said second layer to define at least a second portion of the microelectromechanical system device.
497 Citations
43 Claims
-
1. A method of fabricating a microelectromechanical system device, comprising:
-
forming a first conductive layer on a substrate; depositing at least one first layer on the first conductive layer; patterning said first layer to define at least a first portion of said microelectromechanical system device; depositing a second layer on said first layer, wherein the second layer comprises a negative-acting photoresist; patterning said second layer using said first layer as a photomask; developing said second layer to form a plurality of a supports of the microelectromechanical system device; and forming a structural layer over the supports. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 43)
-
-
12. A method of forming a microelectromechanical system (MEMS) device, the method comprising:
-
depositing a conductive layer over a substrate; forming a first layer over the conductive layer; forming a first element over the first layer; forming a spacer layer over the first element; forming a first support element over the first element; forming a first support element of the microelectromechanical system device over the first element; forming a second element over at least a portion of the first support element; and
substantially removing the first layer. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
-
-
28. A method of forming a microelectromechanical system (MEMS) device, the method comprising:
-
providing a substrate; providing a conductive material over the substrate; providing a first sacrificial material over the conductive layer; patterning the first sacrificial material; forming a first material over the first sacrificial material such that at least a portion of the first material contacts at least a portion of the conductive material; providing a second sacrificial material over the first material; forming a support material over the first material; forming a second material over at least a portion of the support material; and substantially removing the first sacrificial material. - View Dependent Claims (29)
-
-
30. A method of forming a microelectromechanical system (MEMS) device, the method comprising:
-
providing a substrate; providing a first conductive layer over at least a portion of the substrate; providing a second conductive layer over at least a portion of the first conductive layer; forming a spacer layer over at least a portion of the second conductive layer; patterning the spacer layer to form a plurality of supports of the microelectromechanical system device; and applying a film over the plurality of supports, wherein at least a portion of the film is disposed over at least a portion of the second conductive layer, and wherein at least a portion of the film is is supported by the plurality of supports. - View Dependent Claims (31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42)
-
Specification