Method of making microsensor

• US 7,250,322 B2
• Filed: 03/16/2005
• Issued: 07/31/2007
• Est. Priority Date: 03/16/2005
• Status: Active Grant

• Current Assignee: Google LLC (Alphabet Inc.)
• Original Assignee: Delphi Technologies, Inc. (BorgWarner Incorporated)
• Inventors: Chilcott, Dan W., Zarabadi, Seyed R., Christenson, John C.
• Primary Examiner(s): Lebentritt, Michael
• Assistant Examiner(s): Ullah, Elias
• Application Number:
  US11/081,422
• Publication Number:
  US 20060211161A1
• Time in Patent Office: 867 Days
• Field of Search: 438/719, 438/735, 438/48
• US Class Current: 438/50
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 2203/033 Trenches
• CPC Class Codes: B81C 1/00047 Cavities
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: G01P 2015/082 for two degrees of freedom of movement of a single mass

Abstract

A linear accelerometer is provided having a support substrate, fixed electrodes having fixed capacitive plates, and a movable inertial mass having movable capacitive plates capacitively coupled to the fixed capacitive plates. Adjacent capacitive plates vary in height. The accelerometer further includes support tethers for supporting the inertial mass and allowing movement of the inertial mass upon experiencing a linear acceleration along a sensing axis. The accelerometer has inputs and an output for providing an output signal which varies as a function of the capacitive coupling and is indicative of both magnitude and direction of vertical acceleration along the sensing Z-axis. A microsensor fabrication process is also provided which employs a top side mask and etch module.

Claims

1. A method of making a microsensor comprising the steps of:

forming at least one cavity in the top surface of a substrate;

providing a device layer on top of the substrate extending over the cavity, the device layer comprises a lower surface overlaying the cavity that is substantially planar;

forming at least one reduced height region in a top surface of the device layer using a mask and etch module, wherein the mask and etch module etches material from the top surface of the device layer; and

forming one or more trenches in the device layer to form one or more components of a microsensor.

2. The method as defined in claim 1 further comprising the steps of:

forming a dielectric layer on top of the device layer;

etching one or more regions in the dielectric layer to form one or more openings; and

forming metal in select one or more regions to contact the device layer.

3. The method as defined in claim 1, wherein the device layer comprises a conductive EPI material.

4. The method as defined in claim 3, wherein the conductive EPI material comprises silicon.

5. The method as defined in claim 1, wherein the step of forming at least one reduced height region in the device layer comprises:

applying a photoresist material on a top surface of the device layer;

exposing one or more mask areas; and

etching select areas to realize the reduced height.

6. The method as defined in claim 5, wherein the step of etching comprises etching for a predetermined time to achieve a desired height etch.

7. The method as defined in claim 1, wherein the method forms an accelerometer microsensor.

8. The method as defined in claim 7, wherein the accelerometer comprises a linear accelerometer.

9. The method as defined in claim 1, wherein the microsensor senses dynamic motion in a sensing axis perpendicular to the substrate.

10. The method as defined in claim 1, wherein said step of forming one or more trenches comprises etching the device layer into a portion of the reduced height region.

11. A method of making a microsensor comprising the steps of:

forming at least one cavity in the top surface of a substrate;

providing a conductive device layer on top of the substrate extending over the cavity, the device layer comprises a lower surface overlaying the cavity that is substantially planar;

forming at least one reduced height region in a top surface of the device layer using a mask and etch module, wherein the mask and etch module etches material from the top surface of the device layer; and

forming trenches in the device layer that define a plurality of capacitive plates arranged to provide a capacitive coupling, wherein the capacitive coupling serves to sense acceleration.

12. The method as defined in claim 11, wherein the step of forming trenches further comprises forming a movable electrode and one or more fixed electrodes, wherein the plurality of capacitive plates include fixed and movable capacitive plates.

13. The method as defined in claim 11 further comprising the steps of:

forming a dielectric layer on top of the conductive device layer;

etching one or more regions in the dielectric layer to form one or more openings; and

forming metal in select one or more regions to contact the conductive device layer.

14. The method as defined in claim 11, wherein the step of forming at least one reduced height region in the conductive device layer comprises:

applying a photoresist material on a top surface of the conductive device layer;

exposing one or more mask areas; and

etching select areas to realize the reduced height.

15. The method as defined in claim 14, wherein the step of etching comprises applying an etchant for a predetermined time to achieve a desired height etch.

16. The method as defined in claim 11, wherein the method form an accelerometer microsensor.

17. The method as defined in claim 16, wherein the accelerometer comprises a linear accelerometer.

18. The method as defined in claim 11, wherein the microsensor senses dynamic motion in a sensing axis perpendicular to the substrate.

19. The method as defined in claim 11, wherein said step of forming one or more trenches comprises etching the device layer into a portion of the reduced height region.