Method and system of releasing a MEMS structure
First Claim
Patent Images
1. A MEMs (microelectromechanical systems) structure comprising:
- a substrate wafer including a MEMs device formed on a surface of the substrate wafer; and
a MEMs cover structure to cover the MEMs device formed on the surface of the substrate wafer, the MEMs cover structure comprising a first wafer bonded to a second wafer,wherein only the first wafer of the MEMs cover structure is sawed through and not the second wafer of the MEMs cover structure during dicing of the MEMs structure.
1 Assignment
0 Petitions
Accused Products
Abstract
A MEMs (microelectromechanical systems) structure is provided. In one implementation, the MEMs structure includes a substrate wafer including a MEMs device formed on a surface of the substrate wafer, and a MEMs cover structure to cover the MEMs device formed on the surface of the substrate wafer. The MEMs cover structure comprises a first wafer bonded to a second wafer, in which only the first wafer of the MEMs cover structure is sawed through and not the second wafer of the MEMs cover structure during dicing of the MEMs structure.
110 Citations
8 Claims
-
1. A MEMs (microelectromechanical systems) structure comprising:
-
a substrate wafer including a MEMs device formed on a surface of the substrate wafer; and a MEMs cover structure to cover the MEMs device formed on the surface of the substrate wafer, the MEMs cover structure comprising a first wafer bonded to a second wafer, wherein only the first wafer of the MEMs cover structure is sawed through and not the second wafer of the MEMs cover structure during dicing of the MEMs structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
Specification