Probe station with low inductance path

• US 7,250,779 B2
• Filed: 09/25/2003
• Issued: 07/31/2007
• Est. Priority Date: 11/25/2002
• Status: Active Grant

• Current Assignee: FormFactor Incorporated
• Original Assignee: Cascade Microtech Incorporated (FormFactor Incorporated)
• Inventors: Dunklee, John, Cowan, Clarence E.
• Primary Examiner(s): Nguyen; Ha Tran
• Assistant Examiner(s): Chan; Emily Y
• Application Number:
  US10/672,655
• Publication Number:
  US 20050099192A1
• Time in Patent Office: 1,405 Days
• Field of Search: 324750-765, 324/158.1
• US Class Current: 324/754.03
• CPC Class Codes: G01R 31/2851 Testing of integrated circuits [IC] G01R31/317 takes precedence; testing individual devices G01R31/26; testing printed circuits G01R31/2801
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: G01R 31/2887 involving moving the probe head or the IC under test; docking stations moving single probes G01R1/06705; moving individual probes in multiple probes G01R1/07392

Abstract

A probe assembly suitable for making test measurements using test signals having high currents. The disclosed probe assembly provides for a test signal exhibiting relatively low inductance when compared to existing probe assemblies by preferably reducing the electrical path distance between the test instrumentation and the electrical device being tested.

Claims

1. A probe assembly for probing an electrical device, said probe assembly comprising:

(a) a chuck having a first conductive member with a support surface suitable for supporting an electrical device; and

(b) a second conductive member having a substantially planar surface spaced apart from, and opposed to, said support surface of said chuck, wherein said support surface is electrically interconnected to said second conductive member;

(c) wherein said second conductive member is electrically interconnected to a test signal of said electrical device.

2. The probe assembly of claim 1 wherein said first conductive member comprises a first plate, said second conductive member comprises a second plate, and wherein said second conductive member is spaced further distant from said electrical device than said first conductive member.

3. The probe assembly of claim 1 wherein said second conductive member comprises a second plate and is vertically spaced apart from said first conductive member.

4. The probe assembly of claim 1 wherein said second conductive member is electrically interconnected to said support surface completely within an environmental chamber.

5. The probe assembly of claim 1 wherein said second conductive member is free from being supported by said chuck.

6. The probe assembly of claim 1 wherein said first conductive member is electrically interconnected to a first probe, wherein said second conductive member is electrically interconnected to a second probe.

7. The probe assembly of claim 1 wherein said first conductive member and said second conductive member are electrically interconnected to a first probe.

8. The probe assembly of claim 1 wherein said first conductive member is electrically interconnected to a first probe and wherein said first probe is electrically interconnected to test instrumentation using a conductive element having a length, at least 50% of said length comprising a twisted pair of wires.

9. The probe assembly of claim 1 further comprising a detachable substantially closed loop member engageable with said first conductive member and said second conductive member, where said loop member includes a flexible member interconnecting said first conductive member and said second conductive member.