Method and apparatus for multiband frequency distributed circuit with FSS
First Claim
Patent Images
1. A multiband frequency distributed circuit apparatus with FSS, comprising:
- a) a circuit including a top surface and a bottom surface;
b) a first dielectric layer, operatively coupled to said circuit;
c) a first FSS layer, operatively coupled to said first dielectric layer, capable of passing a first frequency band;
d) a second layer, operatively coupled to said first FSS layer, wherein said second layer comprises a dielectric material;
e) a ground plane, operatively coupled to said second layer.
1 Assignment
0 Petitions
Accused Products
Abstract
A method and apparatus for a multiband frequency distributed circuit apparatus with FSS. The apparatus includes a circuit, a first dielectric layer, a first FSS layer, a second layer and a ground plane. The first dielectric layer is operatively coupled to the circuit. The first FSS layer is operatively coupled to the first dielectric layer and is capable of passing a first frequency band. The second layer is operatively coupled to the first FSS layer and includes a dielectric material. The ground plane is operatively coupled to the second layer. A method for implementing a multiband frequency distributed circuit is also disclosed.
16 Citations
24 Claims
-
1. A multiband frequency distributed circuit apparatus with FSS, comprising:
-
a) a circuit including a top surface and a bottom surface; b) a first dielectric layer, operatively coupled to said circuit; c) a first FSS layer, operatively coupled to said first dielectric layer, capable of passing a first frequency band; d) a second layer, operatively coupled to said first FSS layer, wherein said second layer comprises a dielectric material; e) a ground plane, operatively coupled to said second layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
-
-
15. A method for a multiband frequency distributed circuit with FSS, the method comprising the steps of:
-
a) coupling a circuit on a first dielectric layer, wherein said circuit includes a top surface and a bottom surface; b) coupling a first FSS layer on said first dielectric layer; c) coupling a second layer on said first FSS layer, wherein said second layer comprises at least one dielectric layer; d) coupling a ground plane to said second layer. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23)
-
-
24. A multiband frequency distributed circuit apparatus, comprising:
-
a) means for coupling a circuit on a first dielectric layer, wherein said circuit includes a top surface and a bottom surface; b) means for coupling a first FSS layer on said first dielectric layer; c) means for coupling a second layer on said first FSS layer, wherein said second layer comprises at least one dielectric layer; d) means for coupling a ground plane to said second layer.
-
Specification