Temperature tuning the wavelength of a semiconductor laser using a variable thermal impedance

• US 7,251,261 B2
• Filed: 05/12/2005
• Issued: 07/31/2007
• Est. Priority Date: 05/14/2004
• Status: Expired due to Fees

• Current Assignee: Redox Biomedical, Inc.
• Original Assignee: C8 MediSensors, Inc.
• Inventors: Lipson, Jan
• Primary Examiner(s): Harvey; Minsun Oh
• Assistant Examiner(s): Nguyen; Tuan N.
• Application Number:
  US11/129,165
• Publication Number:
  US 20060083273A1
• Time in Patent Office: 810 Days
• Field of Search: 372/36, 372/34, 372/32, 372/107
• US Class Current: 372/34
• CPC Class Codes: H01S 5/02446 Cooling being separate from the laser chip cooling
• CPC Class Codes: H01S 5/02453 Heating, e.g. the laser is heated for stabilisation against temperature fluctuations of the environment H01S5/0612 takes precedence, for monolithically integrated heaters see also H01S5/0261
• CPC Class Codes: H01S 5/0612 controlled by temperature
• CPC Class Codes: H01S 5/06804 by monitoring an external parameter, e.g. temperature

Abstract

An apparatus is described in which the temperature of a semiconductor laser (or other device) can be set to a desired value by using the heat generated by the laser itself in conjunction with an adjustable thermal impedance heat sink to effect the desired temperature rise.

Claims

1. An apparatus for tuning a wavelength of a semiconductor laser comprising:

a semiconductor laser, wherein a wavelength of an optical beam produced by the semiconductor laser varies as a function of a temperature of the semiconductor laser;

an adjustable heat sink thermally coupled to the semiconductor laser, the heat sink having an adjustable thermal impedance, wherein a temperature of laser varies according to θ

Δ

W+Δ

T, wherein θ

is the thermal impedance of the heat sink and Δ

W is change in power consumption and Δ

T is change in temperature of the heat sink, and for substantially constant temperature of the heat sink, the temperature of the laser is adjustable by adjusting θ

, the heat sink comprising

a first heat sink portion thermally coupled to the semiconductor laser; and

a second heat sink portion capable of being switchably thermally coupled or decoupled to the first heat sink portion; and

a controller for adjusting the thermal impedance of the heat sink by adjusting a duty cycle of the thermal coupling of the second heat sink portion to the first heat sink portion to maintain the wavelength of the optical beam at a given wavelength.

2. The apparatus of claim 1 wherein the temperature of the semiconductor laser is determined primarily by heat generated by the semiconductor laser and the thermal impedance of the heat sink.

3. The apparatus of claim 1 wherein the semiconductor laser is not actively heated or cooled by an external device to maintain the wavelength of the optical beam at a given wavelength.

4. The apparatus of claim 1 wherein transfer of heat generated by the semiconductor laser occurs primarily through the heat sink.

5. The apparatus of claim 1 further comprising:

a secondary heater, wherein the controller activates the heater for initial heating of the semiconductor laser.

6. The apparatus of claim 1 further comprising:

a secondary heater, wherein the controller activates the heater for supplemental heating of the semiconductor laser.

7. The apparatus of claim 6 wherein the secondary heater comprises a resistive heater.

8. The apparatus of claim 1 wherein the controller comprises a processor.

9. The apparatus of claim 1 further comprising:

a temperature sensor for sensing a temperature of the semiconductor laser, wherein the controller is coupled to the temperature sensor and adjusts the thermal impedance of the heat sink to maintain the temperature of the semiconductor laser at a temperature that corresponds to the given wavelength.

10. The apparatus of claim 1 further comprising:

a wavelength sensor for sensing a wavelength of the optical beam, wherein the controller is coupled to the wavelength sensor and adjusts the thermal impedance of the heat sink to maintain the wavelength of the optical beam at the given wavelength.

21. The apparatus of claim 1 wherein the wavelength of the optical beam is adjustable over a range of wavelengths.

22. The apparatus of claim 21 wherein the range of wavelengths spans at least 1.0 nm.

11. An apparatus for tuning a wavelength of a semiconductor laser comprising:

a semiconductor laser, wherein a wavelength of an optical beam produced by the semiconductor laser varies as a function of a temperature of the semiconductor laser;

a heat sink thermally coupled to the semiconductor laser, the heat sink comprising

a first heat sink portion thermally coupled to the semiconductor laser;

a second heat sink portion capable of being switchably thermally coupled or decoupled to the first heat sink portion; and

an actuator for making and breaking mechanical contact between the first heat sink portion and the second heat sink portion, thereby switchably thermally coupling and decoupling the first heat sink portion and the second heat sink portion;

a controller for adjusting the thermal impedance of the heat sink by adjusting a duty cycle of the thermal coupling of the second heat sink portion to the first heat sink portion to maintain the wavelength of the optical beam at a given wavelength.

12. The apparatus of claim 11 wherein the actuator comprises a solenoid.

13. The apparatus of claim 12 wherein the solenoid is latching in a contacting position and/or a non-contacting position.

14. An apparatus for tuning a wavelength of a semiconductor laser comprising:

a semiconductor laser, wherein a wavelength of an optical beam produced by the semiconductor laser varies as a function of a temperature of the semiconductor laser;

a heat sink thermally coupled to the semiconductor laser, the heat sink comprising a first heat sink portion thermally coupled to the semiconductor laser; and

a second heat sink portion in thermal contact with the first heat sink portion, wherein an area of the thermal contact is adjustable over a range of areas; and

a controller for adjusting the thermal impedance of the heat sink to maintain the wavelength of the optical beam at a given wavelength, and wherein the controller adjusts the thermal impedance of the heat sink by adjusting the area of the thermal contact.

15. The apparatus of claim 14 further comprising:

a deformable material forming the area of thermal contact.

16. The apparatus of claim 15 wherein the deformable material is a liquid.

17. The apparatus of claim 15 wherein the deformable material is spherical in shape.

18. An apparatus for tuning a wavelength of a semiconductor laser comprising:

a semiconductor laser, wherein a wavelength of an optical beam produced by the semiconductor laser varies as a function of a temperature of the semiconductor laser;

a heat sink having an adjustable thermal impedance, the heat sink comprising a second heat sink portion; and

a first heat sink portion thermally coupling the semiconductor laser to the second heat sink portion, wherein the first heat sink portion is otherwise thermally insulated by glass partially filled with air; and

a controller for adjusting the thermal impedance of the heat sink to maintain the wavelength of the optical beam at a given wavelength.

19. An apparatus for tuning a wavelength of a semiconductor laser comprising:

a semiconductor laser, wherein a wavelength of an optical beam produced by the semiconductor laser varies as a function of a temperature of the semiconductor laser;

a heat sink having an adjustable thermal impedance, the heat sink comprising

a first heat sink portion thermally coupled to the semiconductor laser, wherein the first heat sink portion is part of an integrated assembly also comprising conductive traces for making electrical connection to the semiconductor laser; and

a second heat sink portion capable of being adjustably thermally coupled to the first heat sink portion; and

a controller for adjusting the thermal impedance of the heat sink to maintain the wavelength of the optical beam at a given wavelength.

20. The apparatus of claim 19 wherein the first heat sink portion comprises a copper layer of a flex circuit.

23. An apparatus for controlling a temperature of a semiconductor laser comprising:

a semiconductor laser;

an adjustable heat sink thermally coupled to the semiconductor laser, the heat sink having an adjustable thermal impedance, wherein a temperature of laser varies according to θ

Δ

W+Δ

T, wherein θ

is the thermal impedance of the heat sink and Δ

W is the change in power consumption and Δ

T is change in temperature of the heat sink, and for substantially constant temperature of the heat sink, the temperature of the laser is adjustable by adjusting θ

, the heat sink comprising

a first heat sink portion thermally coupled to the semiconductor laser, and

a second heat sink portion capable of being switchably thermally coupled or decoupled to the first heat sink portion; and

a controller for adjusting the thermal impedance of the heat sink by adjusting a duty cycle of the thermal coupling of the second heat sink portion to the first heat sink portion to maintain the temperature of the semiconductor laser at a given temperature.

24. The apparatus of claim 23 wherein the given temperature is adjustable over a temperature range of at least 1°

C.