Electrical apparatus, cooling system therefor, and electric vehicle
First Claim
1. A direct cooling inverter comprising:
- a plurality of semiconductor chips;
a substrate for mounting said plurality of semiconductor chips;
a copper base for mounting said substrate;
a fin formed integrally with said copper base; and
a case having an opening part;
wherein a liquid path of a cooling medium is formed by mounting said copper base on the opening part of said case;
wherein said copper base and said fin are directly cooled by the cooling medium;
wherein said fin is formed in parallel with a longitudinal direction of the liquid path;
wherein the liquid path comprises a cooling part formed at a bottom of said plurality of semiconductor chips and an introducing part for introducing the cooling medium supplied from an outside to the cooling part; and
wherein a cross-sectional area of the liquid path extending from the introducing part up to the cooling part is substantially constant.
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Accused Products
Abstract
An inverter apparatus includes a liquid path in which cooling water flows, and in which the cooling water performs cooling at a cooling part located directly underneath the power circuit part of the inverter apparatus. The liquid path includes a first partial structure part formed between a feed pipe and the cooling part, and having a liquid path cross-sectional profile that is gradually reduced in the short-side direction of the cooling part and that is gradually enlarged in the long-side direction thereof; and a second partial structure part formed between the cooling part and a drain pipe, and having a liquid path cross-sectional profile that is gradually enlarged from the short-side of the cooling part and that is gradually reduced from the long-side thereof.
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Citations
10 Claims
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1. A direct cooling inverter comprising:
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a plurality of semiconductor chips; a substrate for mounting said plurality of semiconductor chips; a copper base for mounting said substrate; a fin formed integrally with said copper base; and a case having an opening part; wherein a liquid path of a cooling medium is formed by mounting said copper base on the opening part of said case; wherein said copper base and said fin are directly cooled by the cooling medium; wherein said fin is formed in parallel with a longitudinal direction of the liquid path; wherein the liquid path comprises a cooling part formed at a bottom of said plurality of semiconductor chips and an introducing part for introducing the cooling medium supplied from an outside to the cooling part; and wherein a cross-sectional area of the liquid path extending from the introducing part up to the cooling part is substantially constant. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification