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Electrical apparatus, cooling system therefor, and electric vehicle

  • US 7,252,167 B2
  • Filed: 06/29/2006
  • Issued: 08/07/2007
  • Est. Priority Date: 04/18/2002
  • Status: Expired due to Fees
First Claim
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1. A direct cooling inverter comprising:

  • a plurality of semiconductor chips;

    a substrate for mounting said plurality of semiconductor chips;

    a copper base for mounting said substrate;

    a fin formed integrally with said copper base; and

    a case having an opening part;

    wherein a liquid path of a cooling medium is formed by mounting said copper base on the opening part of said case;

    wherein said copper base and said fin are directly cooled by the cooling medium;

    wherein said fin is formed in parallel with a longitudinal direction of the liquid path;

    wherein the liquid path comprises a cooling part formed at a bottom of said plurality of semiconductor chips and an introducing part for introducing the cooling medium supplied from an outside to the cooling part; and

    wherein a cross-sectional area of the liquid path extending from the introducing part up to the cooling part is substantially constant.

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