Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids

• US 7,252,861 B2
• Filed: 05/07/2003
• Issued: 08/07/2007
• Est. Priority Date: 05/07/2002
• Status: Expired due to Term

• Current Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Original Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Inventors: Smalley, Dennis R.
• Primary Examiner(s): Wong; Edna
• Application Number:
  US10/434,519
• Publication Number:
  US 20040007470A1
• Time in Patent Office: 1,553 Days
• Field of Search: 205/118, 205/135, 205/170, 205/181, 205/182, 205/220, 205/221, 205/223, 427/258, 427/264, 427/265, 427/270, 427/271, 427/272, 427/282, 427/402
• US Class Current: 427/264
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B33Y 50/00 Data acquisition or data processing for additive manufacturing
• CPC Class Codes: B33Y 50/02 for controlling or regulating additive manufacturing processes
• CPC Class Codes: B81B 2201/042 Micromirrors, not used as optical switches
• CPC Class Codes: B81C 1/00126 Static structures not provided for in groups B81C1/00031 - B81C1/00119
• CPC Class Codes: B81C 1/0038 Processes for creating layers of materials not provided for in groups B81C1/00357 - B81C1/00373
• CPC Class Codes: C23C 18/1605 by masking
• CPC Class Codes: C23C 18/1651 Two or more layers only obtained by electroless plating
• CPC Class Codes: C25D 1/003 3D structures, e.g. superposed patterned layers
• CPC Class Codes: C25D 5/02 Electroplating of selected surface areas
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G06F 30/392 Floor-planning or layout, e.g. partitioning or placement
• CPC Class Codes: H01L 21/2885 using an external electrical current, i.e. electro-deposition
• CPC Class Codes: H01L 21/76885 By forming conductive members before deposition of protective insulating material, e.g. pillars, studs
• CPC Class Codes: H01P 1/202 Coaxial filters cascaded coaxial cavities H01P1/205
• CPC Class Codes: H01P 11/00 Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
• CPC Class Codes: H01P 11/005 Manufacturing coaxial lines
• CPC Class Codes: H01P 3/06 Coaxial lines
• CPC Class Codes: H01P 5/183 at least one of the guides being a coaxial line
• CPC Class Codes: H05K 3/4647 : by applying an insulating layer around previously made via studs

Abstract

Multi-layer structures are electrochemically fabricated by depositing a first material, selectively etching the first material (e.g. via a mask), depositing a second material to fill in the voids created by the etching, and then planarizing the depositions so as to bound the layer being created and thereafter adding additional layers to previously formed layers. The first and second depositions may be of the blanket or selective type. The repetition of the formation process for forming successive layers may be repeated with or without variations (e.g. variations in: patterns; numbers or existence of or parameters associated with depositions, etchings, and or planarization operations; the order of operations, or the materials deposited). Other embodiments form multi-layer structures using operations that interlace material deposited in association with some layers with material deposited in association with other layers.

Claims

1. A fabrication process for forming a multi-layer three-dimensional structure from at least one structural material, comprising:

(a) forming and adhering a given layer of at least one structural material and at least one sacrificial material to an at least partially formed previous layer and/or to a substrate; and

(b) repeating the forming and adhering of (a) a plurality of times to build up a three-dimensional structure from a plurality of adhered layers;

wherein the formation of a plurality of the adhered layers comprises beginning a deposition operation to form a portion of a current layer prior to completing a deposition operation to form a portion of a prior layer, and

wherein after formation of the adhered layers, separating at least a portion of the at least one sacrificial material, located on multiple layers, from the at least one structural material to release multiple layers of the three-dimensional structure.

2. The process of claim 1 wherein the formation of the given layer comprises electrodeposition of a structural material of the at least one structural material or a sacrificial material of the at least one sacrificial material.

3. The process of claim 1 wherein the prior layer is separated from the current layer by at least one intermediate layer.

4. The process of claim 3 wherein an etching operation associated with formation of either the current layer or the intermediate layer removes material from the intermediate layer and from the prior layer to form at least one void, wherein the at least one void is filled during the deposition operation to form a portion of the current layer.

5. A fabrication process for forming a multi-layer three-dimensional structure from one or more structural materials, comprising:

(a) forming and adhering a given layer, comprising at least two materials, to an at least partially formed previous layer and/or to a substrate; and

(b) repeating the forming and adhering of (a) a plurality of times to build up a three-dimensional structure from a plurality of adhered layers;

wherein the formation of a plurality of the adhered layers comprises beginning a deposition operation to form a portion of a current layer prior to completing a deposition operation to form a portion of a prior layer; and

wherein the formation of the prior layer, comprises;

(c) depositing one or more structural materials;

(d) depositing one or more sacrificial materials;

(e) planarizing at least one deposited material such that the resulting position of the deposited material bounds a level of the prior layer; and

(f) etching into at least one of the one or more structural materials at one or more positions and to one or more depths to form at least one or more voids in the prior layer such that the one or more voids do not expose a sacrificial material located on a layer preceding the prior layer;

wherein after formation of the adhered layers, separating at least a portion of the one or more sacrificial materials, located on multiple layers, from the one or more structural materials to release multiple layers of the three-dimensional structure.

6. The process of claim 5 wherein the depositing of the one or more structural materials comprises an electrodeposition of a structural material or the depositing of the one or more sacrificial materials comprises an electrodeposition of a sacrificial material.

7. The process of claim 5 wherein the formation of the prior layer further comprises:

(g) simultaneously depositing at least one of the one or more structural materials to form part of the prior layer and part of the current layer wherein the at least one of the at least one or more structural materials is deposited into the one or more voids formed in the prior layer.

8. A fabrication process for forming a multi-layer three dimensional structure from one or more structural materials, comprising:

(a) forming and adhering a given layer, comprising at least two materials, to an at least partially formed previous layer and/or to a substrate; and

(b) repeating the forming and adhering of (a) a plurality of times to build up a three-dimensional structure from a plurality of adhered layers;

wherein the formation of a plurality of the adhered layers, comprises beginning a deposition operation to form a portion of a current layer prior to completing a deposition operation to form a portion of a prior layer; and

wherein the formation of the prior layer, comprises;

(c) depositing one or more structural materials;

(d) depositing one or more sacrificial materials;

(e) planarizing at least one deposited material such that the resulting position of the deposited material bounds a level of the prior layer; and

(f) etching into at least one of the one or more structural materials at one or more positions and to one or more depths to form one or more voids such that at least one or more of the one or more voids expose a sacrificial material located on a layer preceding the prior layer;

wherein after formation of the adhered layers, separating at least a portion of the one or more sacrificial materials, located on multiple layers, from the one or more structural materials to release multiple layers of the three-dimensional structure.

9. The process of claim 8 wherein the depositing of the one more structural materials comprises an electrodeposition of at least one of the one or more structural materials.

10. The process of claim 8 wherein the formation of the prior layer further comprises:

(g) simultaneously depositing at least one of the one or more structural materials to form part of the prior layer and part of the current layer wherein the at least one of the one or more structural materials is deposited into the one or more voids.

11. A fabrication process for forming a multi-layer three-dimensional structure from at least one structural material, comprising:

(a) forming and adhering a given layer, comprising at least one structural material and at least one sacrificial material, to an at least partially formed previous layer and/or to a substrate; and

(b) repeating the forming and adhering of (a) a plurality of times to build up a three-dimensional structure from a plurality of adhered layers;

wherein for a plurality of the adhered layers a deposition of the at least one structural material to form a portion of a current layer results in deposition of the at least one structural material into one or more voids in a partially formed prior layer, comprising the at least one structural material and the at least one sacrificial material, such that a portion of the prior layer is also formed by the deposition of the at least one structural material, and

wherein after formation of the adhered layers, separating multiple layers of the at least one sacrificial material from the at least one structural material to release multiple layers of the three-dimensional structure.

12. The process of claim 11 wherein the formation of the given layer comprises electrodeposition of the at least one structural material or the at least one sacrificial material.

13. The process of claim 11 wherein the partially formed prior layer does not receive deposition of the at least one structural material at each location until formation of the current layer is initiated.

14. The process of claim 11 wherein a temporary fill material, different from the at least one structural material, is made to temporarily fill in a void location in the prior layer, the temporary fill material is thereafter removed to create a void, and the at least one structural material is made to fill the void during a formation of the current layer.

15. The process of claim 11 wherein the voids in the partially formed prior layer are formed via an etching operation that removes a portion of the at least one structural material from the prior layer so as to form the voids which result in the partially formed prior layer.

16. The process of claim 11 wherein the forming of each of the plurality of the adhered layers comprises one or more planarization operations which removes a portion of nee or more of the at least one structural material and the at least one sacrificial material to set a boundary level for each of the plurality of the adhered layers.

17. The process of claim 11 wherein at least one of the at least one sacrificial materials comprises a metal and at least one of the at least one structural materials comprises a metal.

18. A fabrication process for forming a multi-layer three-dimensional structure, comprising:

(a) forming and adhering a layer of one or more materials to a previously formed layer and/or to a substrate; and

(b) repeating the forming and adhering of (a) a plurality of times to build up a three-dimensional structure from a plurality of adhered layers;

wherein the forming of each of a plurality of the adhered layers comprises one or more planarization operations which removes a portion of the one or more materials to set a boundary level for each of the plurality of the adhered layers, and

wherein for a plurality of the adhered layers forming interlacing elements in association with given layers that extend from the given layers into preceding layers and result in higher levels of interlacing between the one or more materials deposited in association with the given layers and one or more materials deposited in association with the preceding layers than would exist in absence of the interlacing elements.

19. The process of claim 18 wherein the formation of the plurality of the adhered layers comprises electrodeposition of at least one of the one or more materials.

20. The process of claim 18 wherein at least some of the interlacing elements extend from a given layer through an intermediate layer to a preceding layer.

21. The process of claim 20 wherein the interlacing elements are located in a staggered manner such that interconnection of layers occurs via a plurality of the interlacing elements that each connect at least three layers and such that an inter-connected network extending a greater distance than the height of any single interlacing element occurs.

22. The process of claim 21 wherein the staggered manner results in the given layer further comprising at least one additional interlacing element having a configuration selected from the group of:

(1) an interlacing element that originates on a subsequent layer, extends through the given layer and ends on the preceding layer; and

/or

(2) an interlacing element that originates on a subsequent layer that is separated from the given layer by at least one intermediate layer and that ends on the given layer.

23. The process of claim 18 wherein some interlacing element have different heights.

24. The process of claim 23 wherein the heights of at least some of the interlacing elements are at least in part dictated by the location of the interlacing elements relative to at least one element selected from the group consisting of (1) an outward facing-surface of the structure, (2) an outward facing surface associated with a single structural material, (3) a particular group of structural materials, and (4) interference between the interlacing elements and other interlacing elements.

25. The process of claim 18 wherein the given layers comprises at least one structural material and at least one sacrificial material, and wherein after the forming of the plurality of adhered layers, separating the at least one sacrificial material, located on multiple layers, from the at least one structural material to release the three-dimensional structure.

26. The process of claim 18 wherein the forming of the plurality of adhered layers comprises a selective patterning operation selected from the group consisting of (1) selectively etching voids in one of the one or more materials in which an interlacing element is to be formed, and (2) selectively depositing one of the one or more materials.

27. The process of claim 26 wherein the selective patterning comprises use of a mask selected from the group consisting of:

(1) a contact mask, (2) a proximity mask, and (3) an adhered mask.