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Method to improve mechanical strength of low-k dielectric film using modulated UV exposure

  • US 7,253,125 B1
  • Filed: 04/16/2004
  • Issued: 08/07/2007
  • Est. Priority Date: 04/16/2004
  • Status: Active Grant
First Claim
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1. A method of treating dielectric film on a substrate, the method comprising:

  • (a) exposing the dielectric film to ultraviolet radiation with a first light intensity during a first time increment;

    (b) exposing the dielectric film to ultraviolet radiation with a second light intensity during a second time increment, wherein the first and second light intensities are different; and

    (c) repeating (a) and (b) at least twice in a manner that provides modulated ultraviolet radiation exposure that significantly increases the hardness and modulus of the dielectric film.

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