Method to improve mechanical strength of low-k dielectric film using modulated UV exposure
First Claim
Patent Images
1. A method of treating dielectric film on a substrate, the method comprising:
- (a) exposing the dielectric film to ultraviolet radiation with a first light intensity during a first time increment;
(b) exposing the dielectric film to ultraviolet radiation with a second light intensity during a second time increment, wherein the first and second light intensities are different; and
(c) repeating (a) and (b) at least twice in a manner that provides modulated ultraviolet radiation exposure that significantly increases the hardness and modulus of the dielectric film.
1 Assignment
0 Petitions
Accused Products
Abstract
Methods and apparatus for improving mechanical properties of a dielectric film on a substrate are provided. In some embodiments, the dielectric film is a carbon-doped oxide (CDO). The methods involve the use of modulated ultraviolet radiation to increase the mechanical strength while limiting shrinkage and limiting any increases in the dielectric constant of the film. Methods improve film hardness, modulus and cohesive strength, which provide better integration capability and improved performance in the subsequent device fabrication procedures such as chemical mechanical polishing (CMP) and packaging.
-
Citations
32 Claims
-
1. A method of treating dielectric film on a substrate, the method comprising:
-
(a) exposing the dielectric film to ultraviolet radiation with a first light intensity during a first time increment; (b) exposing the dielectric film to ultraviolet radiation with a second light intensity during a second time increment, wherein the first and second light intensities are different; and (c) repeating (a) and (b) at least twice in a manner that provides modulated ultraviolet radiation exposure that significantly increases the hardness and modulus of the dielectric film. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
-
-
19. A method of treating dielectric film on a substrate, the method comprising:
-
(a) exposing the dielectric film to ultraviolet radiation with a first light intensity during a first time increment; (b) exposing the dielectric film to ultraviolet radiation with a second light intensity during a second time increment, wherein the first and second light intensities are different and not zero; and (c) repeating (a) and (b) in a manner that provides modulated ultraviolet radiation exposure that significantly increases the hardness and modulus of the dielectric film. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32)
-
Specification