Reconfigurable detector array of resistance bolometers

• US 7,253,411 B2
• Filed: 01/31/2003
• Issued: 08/07/2007
• Est. Priority Date: 02/02/2002
• Status: Expired due to Fees

• Current Assignee: FLIR Systems Trading Belgium (Teledyne Technologies Incorporated)
• Original Assignee: Qinetiq Limited (QinetiQ Group PLC)
• Inventors: Kaushal, Tej Paul, Manning, Paul Antony, Gillham, John Peter
• Primary Examiner(s): Luu; Thanh X.
• Assistant Examiner(s): Ko; Tony
• Application Number:
  US10/503,312
• Publication Number:
  US 20050067556A1
• Time in Patent Office: 1,649 Days
• Field of Search: 250/208.1, 250/208.2, 250/338.1, 250/332
• US Class Current: 250/338.1
• CPC Class Codes: H04N 25/46 by combining or binning pixels
• CPC Class Codes: H04N 25/76 Addressed sensors, e.g. MOS or CMOS sensors
• CPC Class Codes: H04N 5/33 Transforming infrared radiation cameras or camera modules for generating image signals from infrared radiation H04N23/20; circuitry of SSIS for transforming infrared radiation into image signals H04N25/20

Abstract

An Array of detectors can be configured to be read as separate detectors, or to be connected into larger groups, e.g. groups of four (a 2×2 array). This allows the formation of a relatively high definition image, and a much faster formation of a lower resolution image. This may be used with in an automobile to control deployment of safety airbags in accordance with a drivers position relative to the airbags. Preferably the array is a 64×64 array of thermal detectors.

Claims

1. A reconfigurable detector array comprising:

an array of resistance bolometer detectors,

a plurality of switchable connections for connecting together separate detectors therein into at least one larger group of detectors, wherein, the plurality of switchable connections are configurable such that the number of detectors comprising the at least one larger group is variable, and so as to enable separate detectors to be read individually or the at least one larger group of detectors to be read, wherein the plurality of switchable connections are configured so as to ensure that, in use, the electrical impedance of the at least one larger group of detectors is the same as that of a single detector.

2. The array of claim 1 wherein, the switchable connections are configured such that the at least one larger group of detectors comprises one of:

(i) a plurality of sub-groups of detectors connected together electrically in series, each sub-group comprising a plurality of detectors connected together electrically in parallel; and

(ii) a plurality of sub-groups of detectors connected together electrically in parallel, each sub-group comprising a plurality of detectors connected together electrically in series.

3. The array of claim 1 wherein the array is an array of thermal detectors sensitive within the range 3-14 μ

m.

4. The array of claim 1 comprising an x by y array of detectors and wherein the value of at least one of x and y lies in the range 24 to 96 inclusive.

5. The array of claim 1 arranged on a substrate, wherein the substrate carries electronic circuitry for processing the outputs of each detector and for reconfiguring the array into groups of detectors.

6. The array of claim 5 wherein the array and substrate are encapsulated in a single module with the detectors isolated from ambient conditions.

7. The array of claim 1 wherein the detectors may be connected together in groups of four adjacent detectors giving a 2×

2 arrangement.

8. The array of claim 1 wherein the detectors may be connected together in groups of sixteen adjacent detectors giving a 4×

4 arrangement.

9. The array of claim 1 and including means for directing a scene onto the array.

10. A reconfigurable detector array comprising:

an array of separate resistance bolometer detectors; and

a plurality of switchable connection means for variably connecting together said separate detectors into at least one larger group of detectors and for reading separate detectors individually or in said at least one larger group, wherein the plurality of switchable connections are configured to ensure that electrical impedance of said at least one larger group of detectors is substantially the same as impedance of a single detector.

11. The array of claim 10, wherein the switchable connections are configured such that the at least one larger group of detectors comprises one of:

(i) a plurality of sub-groups of detectors connected together electrically in series, each sub-group comprising a plurality of detectors connected together electrically in parallel; and

(ii) a plurality of sub-groups of detectors connected together electrically in parallel, each sub-group comprising a plurality of detectors connected together electrically in series.

12. The array of claim 10, wherein the array is an array of thermal detectors sensitive within the range 3-14 μ

m.

13. The array of claim 10 comprising an x by y array of detectors and wherein the value of at least one of x and y lies in the range 24 to 96 inclusive.

14. The array of claim 10 arranged on a substrate, wherein the substrate carries electronic circuitry far processing the outputs of each detector and for reconfiguring the array into groups of detectors.

15. The array of claim 10, wherein the detectors may be connected together in groups of four adjacent detectors giving a 2×

2 arrangement.

16. The array of claim 10, wherein the detectors may be connected together in groups of sixteen adjacent detectors giving a 4×

4 arrangement.

17. The array of claim 10 and including means for directing a scene onto the array.

18. The array of claim 14, wherein the array and substrate are encapsulated in a singe module with the detectors isolated from ambient conditions.