Light source module of light emitting diode

• US 7,253,449 B2
• Filed: 07/01/2005
• Issued: 08/07/2007
• Est. Priority Date: 02/18/2005
• Status: Active Grant

• Current Assignee: AU Optronics Corporation
• Original Assignee: AU Optronics Corporation
• Inventors: Wu, Meng-Chai
• Primary Examiner(s): Prenty; Mark V.
• Application Number:
  US11/173,097
• Publication Number:
  US 20060197101A1
• Time in Patent Office: 767 Days
• Field of Search: 257/79, 257/99, 257/100, 257/712
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape

Abstract

A light source module for a light emitting diode (LED) is provided. In the present invention, a common printed circuit board (PCB) is utilized to provide electric current and isolated from the heat dissipation mechanism, and the thermal conductive element, protruding from the LED package structure, is connected to another thermal conductive element to dissipate out the internal heat.

Claims

1. A light source module for a light emitting diode, comprising:

a substrate having a bottom and a sidewall;

a printed circuit board having a conductive layer disposed adjacent to the sidewall;

a first thermal conductive element connected to the bottom of the substrate; and

at least one light emitting diode chip disposed on said first thermal conductive element and electrically connected to the conductive layer.

2. The light source module of claim 1, wherein said first thermal conductive element is physically isolated from said printed circuit board.

3. The light source module of claim 1, further comprising a lead inserted into the sidewall and electrically connected to the light emitting diode chip and the conductive layer.

4. The light source module of claim 3, wherein the anode of said light emitting diode chip is electrically connected to the lead, and the cathode of said light emitting diode chip is electrically connected to said first thermal conductive element.

5. The light source module of claim 1, further comprising a first lead and a second lead inserted into the sidewall and electrically connected to the conductive layer, wherein the first lead is electrically connected to the anode of the light emitting diode chip, and the second lead is electrically connected to the cathode of the light emitting diode chip.

6. The light source module of claim 5, further comprising a package colloid, disposed on said substrate, for encapsulating said light emitting diode chip.

7. The light source module of claim 1, further comprising a package colloid, disposed on said substrate, for encapsulating said light emitting diode chip.

8. The light source module of claim 7, further comprising a second thermal conductive element thermally connected to said first thermal conductive element.

9. The light source module of claim 1, further comprising a second thermal conductive element thermally connected to said first thermal conductive element.

10. The light source module of claim 1, wherein said light emitting diode chip is physically isolated from said first thermal conductive element.

11. The light source module of claim 1, wherein said first thermal conductive element comprises metal.

12. The light source module of claim 1, wherein said printed circuit board comprises a fiberglass printed circuit board.

13. The light source module of claim 1, wherein said printed circuit board comprises a flexible printed circuit board.

14. A light source module for a light emitting diode, comprising:

a substrate having a bottom and a sidewall;

a printed circuit board having a conductive layer;

a first thermal conductive element thermally connected to said substrate, the first thermal conductive element being inserted through the bottom of the substrate and isolated from said printed circuit board; and

at least one light emitting diode chip disposed on said first thermal conductive element and electrically connected to the conductive layer.

15. The light source module of claim 14, further comprising a lead inserted into said sidewall and electrically connected to the light emitting diode chip and the conductive layer.

16. The light source module of claim 15, wherein the lead includes an internal lead inserted into the sidewall and an external lead extended to the sidewall and electrically connected to the conductive layer.

17. The light source module of claim 15, wherein the anode of said light emitting diode chip is electrically connected to the lead, and the cathode of said light emitting diode chip is electrically connected to said first thermal conductive element.

18. The light source module of claim 14, further comprising a first lead and a second lead inserted into the sidewall and connected to the conductive layer, wherein the first lead is connected to the anode of the light emitting diode chip, and the second lead is connected to the cathode of the light emitting diode chip.

19. The light source module of claim 14, further comprising a package colloid, disposed on the substrate, for encapsulating said light emitting diode chip.

20. The light source module of claim 14, further comprising a second thermal conductive element connected to said first thermal conductive element.

21. The light source module of claim 14, wherein said light emitting diode chip is physically isolated from said first thermal conductive element.

22. The light source module of claim 14, wherein said first thermal conductive element comprises metal.

23. The light source module of claim 14, wherein said printed circuit board comprises a fiberglass printed circuit board.

24. The light source module of claim 14, wherein said printed circuit board comprises a flexible printed circuit board.