RFID tags and processes for producing RFID tags
First Claim
Patent Images
1. A Radio Frequency Identification (RFID) tag comprising:
- a flexible substrate;
an integrated circuit embedded within the flexible substrate, the top surface of the integrated circuit being coplanar with the flexible substrate;
at least one conductive element formed on the flexible substrate, the at least one conductive element being electrically connected to the integrated circuit, the conductive element serving as an antenna for the RFID tag; and
wherein the at least one conductive element being electrically connected to the integrated circuit is done through an electrical connection that is capacitive in nature.
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Abstract
A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit is coplanar with the flexible substrate. At least one conductive element is formed on the flexible substrate. The conductive element is electrically connected to the integrated circuit. The conductive element serves as an antenna for the RFID tag.
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Citations
58 Claims
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1. A Radio Frequency Identification (RFID) tag comprising:
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a flexible substrate; an integrated circuit embedded within the flexible substrate, the top surface of the integrated circuit being coplanar with the flexible substrate; at least one conductive element formed on the flexible substrate, the at least one conductive element being electrically connected to the integrated circuit, the conductive element serving as an antenna for the RFID tag; and wherein the at least one conductive element being electrically connected to the integrated circuit is done through an electrical connection that is capacitive in nature. - View Dependent Claims (2)
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3. A Radio Frequency Identification (RFID) tag comprising:
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a flexible substrate; an integrated circuit embedded within the flexible substrate, the top surface of the integrated circuit being coplanar with the flexible substrate; at least one conductive element formed on the flexible substrate, the at least one conductive element being electrically connected to the integrated circuit, the conductive element serving as an antenna for the RFID tag; and wherein the at least one conductive element being electrically connected to the integrated circuit is done through an electrical connection that is resistive in nature.
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4. A Radio Frequency Identification (RFID) tag comprising:
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a flexible substrate; an integrated circuit embedded within the flexible substrate, the top surface of the integrated circuit being coplanar with the flexible substrate; at least one conductive element formed on the flexible substrate, the at least one conductive element being electrically connected to the integrated circuit, the conductive element serving as an antenna for the RFID tag; and wherein flexible substrate has a width that is one of slightly greater than or substantially equal to the width of the integrated circuit. - View Dependent Claims (5)
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6. An RFID tag comprising:
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a flexible substrate; an integrated circuit embedded within the flexible substrate, the top surface of the integrated circuit being coplanar with the flexible substrate, wherein the integrated circuit is embedded within the flexible substrate using a fluidic self assembly (FSA) process; a planarization layer is formed over the flexible substrate and the integrated circuit; at least one conductive element formed on the flexible substrate, the at least one conductive element being electrically connected to the integrated circuit through at least one via created in the planarization layer, the conductive element serving as an antenna for the RFID tag. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A method of forming an RFID tag comprising:
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depositing an integrated circuit within a receptor in a flexible substrate using Fluidic Self Assembly; forming at least one conductive trace on the flexible substrate to simultaneously form an electrical connection to the integrated circuit and form an antenna element; and forming a planarization layer over the flexible substrate and the integrated circuit, wherein the electrical connection connected to the integrated circuit through at least one via created in the planarization layer. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36)
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37. A method of forming an RFID tag comprising:
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depositing an integrated circuit within a receptor in a flexible substrate using Fluidic Self Assembly; forming at least one conductive trace on the flexible substrate to simultaneously form an electrical connection to the integrated circuit and form an antenna element, wherein the at least one conductive trace being electrically connected to the integrated circuit is done through an electrical connection that is capacitive in nature.
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38. A method of forming an RFID tag comprising:
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depositing an integrated circuit within a receptor in a flexible using Fluidic Self Assembly; forming at least one conductive trace on the flexible substrate to simultaneously form an electrical connection to the integrated circuit and form an antenna element, wherein the at least one conductive trace being electrically connected to the integrated circuit is done through an electrical connection that is resistive in nature.
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39. A method of forming an RFID tag comprising:
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depositing an integrated circuit within a receptor in a flexible substrate using Fluidic Self Assembly; forming at least one conductive trace on the flexible substrate to simultaneously form an electrical connection to the integrated circuit and form an antenna element, wherein the flexible substrate has a width that is one of slightly greater than or substantially equal to the width of the integrated circuit.
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40. An RFID tag comprising:
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a flexible substrate; an integrated circuit embedded within the flexible substrate, the integrated circuit having a top surface that is coplanar with the flexible substrate; conductive elements formed on the flexible substrate and electrically connected to the integrated circuit, the conductive elements also serving as an antenna for the RFID tag; and wherein the conductive elements are formed on a top surface and bottom surface of the substrate, and wherein an electrical connection is provided to connect the conductive element on the bottom surface to the integrated circuit. - View Dependent Claims (41, 42, 43, 44)
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45. An RFID tag comprising:
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an RFID integrated circuit deposited in a flexible substrate; a first antenna layer coupled to the RFID integrated circuit; and a second antenna layer coupled to the RFID integrated circuit, wherein the first antenna layer is above the RFID integrated circuit and the second antenna layer is below the RFID integrated circuit, wherein the RFID integrated circuit is coupled to the first antenna layer at the top of the RFID integrated circuit and the RFID integrated circuit is coupled to the second antenna layer at the bottom of the RFID integrated circuit.
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46. A method of forming an RFID tag comprising:
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combining blocks, each containing a functional component, with a fluid to form a slurry; dispensing the slurry over a substrate having receptor holes, each of which is designed to receive one of said blocks, wherein the relative size of each hole and block is such that each block is not axially aligned relative to a perimeter of the receptor holes; and wherein each block is configured to include a bottom contact pad and a top contact pad that allow the functional component of the block to interconnect to conductive elements formed on the substrate even when each block is not axially aligned relative to the perimeter of the receptor holes. - View Dependent Claims (47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58)
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Specification