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High density memory module using stacked printed circuit boards

  • US 7,254,036 B2
  • Filed: 04/07/2005
  • Issued: 08/07/2007
  • Est. Priority Date: 04/09/2004
  • Status: Active Grant
First Claim
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1. A module electrically connectable to a computer system, the module comprising:

  • a frame having an edge connector with a plurality of electrical contacts which are electrically connectable to the computer system;

    a first printed circuit board coupled to the frame, the first printed circuit board having a first surface and a first plurality of components mounted on the first surface, the first plurality of components electrically coupled to the electrical contacts of the edge connector;

    a second printed circuit board coupled to the frame, the second printed circuit board having a second surface and a second plurality of components mounted on the second surface, the second plurality of components electrically coupled to the electrical contacts of the edge connector, the second surface of the second printed circuit board facing the first surface of the first printed circuit board; and

    at least one thermally conductive layer positioned between the first plurality of components and the second plurality of components, the at least one thermally conductive layer thermally coupled to the first plurality of components, to the second plurality of components, and to the electrical contacts of the edge connector.

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