Atraumatic sensor lead assemblies

• US 7,254,450 B2
• Filed: 08/13/2004
• Issued: 08/07/2007
• Est. Priority Date: 10/31/2002
• Status: Expired due to Fees

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Sommer, John L., Christopherson, Mark A., Pool, Nancy Perry, Bonde, Eric
• Primary Examiner(s): Layno; Carl
• Assistant Examiner(s): MALAMUD, DEBORAH LESLIE
• Application Number:
  US10/918,060
• Publication Number:
  US 20050021120A1
• Time in Patent Office: 1,089 Days
• Field of Search: 607/119, 607/116, 600/365
• US Class Current: 607/119
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/056 Transvascular endocardial electrode systems

Abstract

The invention is directed to lead configurations for sensors that allow for less invasive sensor replacement procedures. In one configuration, a sensor lead assembly includes an outer lead body and an inner lead including a sensor such as an electrochemical glucose sensor. The inner lead can be positioned in an inner conduit of the outer lead body. The outer lead body may be substantially permanently implanted in the patient, and the inner lead can be implanted through the inner conduit of the outer lead body. Once the sensor of the inner lead has worn out or otherwise exhausted its useful life, the inner lead can be removed, and a new inner lead can be implanted in place of the old inner lead.

Claims

1. A method comprising:

positioning an implantable inner lead relative to a window of an implantable outer lead body to expose a first sensor of the inner lead through the window; and

repositioning the inner lead relative to the window of the outer lead body to expose a second sensor of the inner lead through the window;

wherein the repositioning is performed after the inner lead and the outer lead have been implanted;

the repositioning is accomplished by moving the inner lead within the outer lead body, thereby adjusting the implanted location of the inner lead; and

the implantable medical device automatically activates the repositioning of the inner lead after detecting the failure of the first sensor.

2. The method of claim 1, wherein the inner lead is electrically coupled to the device during a time between the positioning and the repositioning of the inner lead.

3. The method of claim 1, wherein the repositioning of the inner lead is performed by engaging a proximal end of the inner lead by a rotatable structure within a housing of an implantable medical device, the inner lead being electrically coupled to the device during a time between the positioning and the repositioning of the inner lead.

4. The method of claim 1, further comprising implanting the outer lead body prior to the positioning of the inner lead.

5. The method of claim 1, further comprising implanting the outer lead body and the inner lead body after the positioning of the inner lead.

6. A method comprising:

positioning an implantable inner lead relative to a window of an implantable outer lead body to expose a first sensor of the inner lead through the window; and

repositioning the inner lead relative to the window of the outer lead body to expose a second sensor of the inner lead through the window;

wherein the repositioning is performed after the inner lead and the outer lead have been implanted;

the repositioning is accomplished by moving the inner lead within the outer lead body, by pulling a proximal end of the inner lead through a channel of an implantable medical device, the inner lead being electrically coupled to the device, within the channel, during a time between the positioning and the repositioning of the inner lead, thereby adjusting the implanted location of the inner lead;

the proximal end of the inner lead includes a first contact area electrically coupled to the first sensor and a second contact area electrically coupled to the second sensor;

the inner lead is electrically coupled to the device, during the time between the positioning and the repositioning of the inner lead, via electrical contact between the first contact area of the inner lead and an electrical contact of the device exposed within the channel; and

the repositioning of the inner lead results in the second contact area of the inner lead being brought into electrical contact with the electrical contact of the device.