Low-profile package for housing an optoelectronic assembly
First Claim
Patent Images
1. A low-profile package for housing an optoelectric device, comprising:
- an insulating base having an upper surface, wherein an optoelectric device is mounted to the upper surface of the insulating base;
a metal member having a top wall and a bottom wall, wherein the bottom wall of the metal member is attached to the upper surface of the insulating base;
a substantially flat metal cover attached to the top wall of the metal member to hermetically seal the metal cover to the insulating base, wherein the flat metal cover is supported above the optoelectric device by the top wall of the metal member; and
an integrated circuit mounted adjacent to the optoelectric device on the upper surface of the insulating base, wherein the integrated circuit is electrically connected to the optoelectric device.
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Abstract
A low-profile package for housing an optoelectric device is disclosed. The low-profile package includes an insulating base having an upper surface. The optoelectric device is mounted to the upper surface of the insulating base. The low-profile package also includes a metal sealing member having a top wall and a bottom wall. The bottom wall of the metal sealing member is attached to the upper surface of the insulating base. The low-profile package further includes a substantially flat metal cover attached to the top wall of the metal sealing member to thereby hermetically seal the metal cover to the insulating base.
54 Citations
25 Claims
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1. A low-profile package for housing an optoelectric device, comprising:
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an insulating base having an upper surface, wherein an optoelectric device is mounted to the upper surface of the insulating base; a metal member having a top wall and a bottom wall, wherein the bottom wall of the metal member is attached to the upper surface of the insulating base; a substantially flat metal cover attached to the top wall of the metal member to hermetically seal the metal cover to the insulating base, wherein the flat metal cover is supported above the optoelectric device by the top wall of the metal member; and an integrated circuit mounted adjacent to the optoelectric device on the upper surface of the insulating base, wherein the integrated circuit is electrically connected to the optoelectric device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A method for hermetically sealing a substantially flat metal cover to an insulating base, comprising:
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attaching a bottom wall of a metal member to an upper surface of the insulating base; mounting an optoelectric device to the upper surface of the insulating base, wherein the optoelectric device is located within an inner region of the metal member; positioning the substantially flat metal cover over the optoelectric device; attaching the substantially flat metal cover to a top wall of the metal member to hermetically enclose the optoelectric device, wherein the flat metal cover is supported above the optoelectric device by the top wall of the metal; and mounting an integrated circuit adjacent to the optoelectric device on the upper surface of the insulating base, wherein the integrated circuit is electrically connected to the optoelectric device, and wherein both the optoelectric device and the integrated circuit are located within the inner region of the metal member. - View Dependent Claims (19, 20, 21, 22)
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23. A packaged optical module, comprising:
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a base formed of an electrically insulating material and having at least a first surface and a second surface, wherein an optical device is mounted to the first surface of the base; a sealing member formed of an electrically conducting material and attached to the first surface of the base, wherein the sealing member extends along a perimeter of the base with the optical device being located within an inner region of the sealing member; a heat dissipating device attached to the second surface of the base; a substantially flat cover formed of the electrically conducting material, wherein the substantially flat cover is attached to the sealing member on the base to provide a hermetic enclosure for the optical device, wherein the flat metal cover is supported above the optical device by the sealing member; and an electronic circuit mounted to the first surface of the base and electrically connected to the optical device, wherein the electronic circuit is located within the inner region of the sealing member. - View Dependent Claims (24, 25)
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Specification