Selective catalytic activation of non-conductive substrates
First Claim
1. A method of providing a pattern of a metal on a non-conductive substrate, the method comprising the steps of:
- a) applying a catalytic ink in a desired pattern on a surface of the non-conductive substrate, wherein the catalytic ink comprises;
i) a solvent;
ii) a source of catalytic metal ions;
iii) a crosslinking agent;
iv) a copolymer; and
v) a polyurethane polymer;
b) reducing the source of catalytic metal ions to its associated metal with a suitable reducing agent;
c) depositing electroless metal on the pattern of catalytic ink; and
d) plating electrolytic metal on top of the electroless metal layer to a desired thickness to produce the pattern of metal on the non-conductive substrate.
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Accused Products
Abstract
A process of providing a pattern of a metal on a non-conductive substrate to create loop antennae for wireless articles and for creating circuitry for smart cards, such as phone cards is provided. The method comprises the steps of catalyzing the non-conductive substrate by applying a catalytic ink, reducing a source of catalytic metal ions in the catalytic ink to its associated metal, depositing electroless metal on the pattern of catalytic ink on the surface of the substrate; and plating electrolytic metal on the electroless metal layer to produce the desired pattern of metal on the non-conductive substrate. The catalytic ink typically comprises one or more solvents, a source of catalytic metal ions, a crosslinking agent, one or more copolymers, a polyurethane polymer, and, optionally, one or more fillers.
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Citations
59 Claims
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1. A method of providing a pattern of a metal on a non-conductive substrate, the method comprising the steps of:
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a) applying a catalytic ink in a desired pattern on a surface of the non-conductive substrate, wherein the catalytic ink comprises; i) a solvent; ii) a source of catalytic metal ions; iii) a crosslinking agent; iv) a copolymer; and v) a polyurethane polymer; b) reducing the source of catalytic metal ions to its associated metal with a suitable reducing agent; c) depositing electroless metal on the pattern of catalytic ink; and d) plating electrolytic metal on top of the electroless metal layer to a desired thickness to produce the pattern of metal on the non-conductive substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method of providing a pattern of a metal on a non-conductive substrate, the method comprising the steps of:
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a) applying a catalytic ink in a solid pattern with an outline of the desired pattern on a surface of the non-conductive substrate, wherein the catalytic ink comprises; i) one or more solvents; ii) a source of catalytic metal ions; iii) a polyisocyanate crosslinking agent; iv) a copolymer, wherein the copolymer is capable of crosslinking with the polyisocyanate; and v) a polyurethane polymer; b) reducing the source of catalytic metal ions to its associated metal with a suitable reducing agent; c) depositing electroless metal on the pattern of catalytic ink on the surface of the substrate; d) plating electrolytic metal on the electroless metal layer to a desired thickness to produce the desired pattern of metal on the non-conductive substrate e) printing a UV etch resist with the desired pattern; and f) etching away the plated metal between the resist to define the desired circuit. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39)
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40. A method of providing a desired pattern of metal on a non-conductive substrate comprising the steps of:
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a) applying a catalytic ink on a surface of the non-conductive substrate, wherein the catalytic ink comprises; i) a solvent; ii) a source of catalytic metal ions; iii) a crosslinking agent; iv) a copolymer; and v) a polyurethane polymer, b) reducing the source of catalytic metal ions to its associated metal using a suitable reducing agent; c) printing resist in a desired pattern on the catalytic ink on the non-conductive substrate; d) depositing electroless metal on the non-conductive substrate in the areas not covered by the printed resist on the catalytic Ink; and e) plating electrolytic metal on top of the electroless metal deposit. - View Dependent Claims (41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59)
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Specification