Mold release layer transferring film and laminate film

• US 7,255,919 B2
• Filed: 03/11/2003
• Issued: 08/14/2007
• Est. Priority Date: 03/13/2002
• Status: Expired due to Fees

• Current Assignee: Mitsui Mining and Smelting Company Limited
• Original Assignee: Mitsui Mining and Smelting Company Limited
• Inventors: Hayashi, Katsuhiko, Sakata, Ken
• Primary Examiner(s): LAM, CATHY FONG FONG
• Application Number:
  US10/507,242
• Publication Number:
  US 20050167818A1
• Time in Patent Office: 1,617 Days
• Field of Search: 428/352, 428/354, 428/40.1, 428/42.2, 428/42.3, 428/41.4, 428/209, 257/642, 174/254, 174/255, 156/329, 156/344
• US Class Current: 428/352
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 2924/01057 Lanthanum [La]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/10674 Flip chip
• CPC Class Codes: H05K 2203/0195 Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
• CPC Class Codes: H05K 2203/066 Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern transferring an insulating pattern H05K2203/0537
• CPC Class Codes: H05K 2203/1581 Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673
• CPC Class Codes: H05K 3/3494 Heating methods for reflowing of solder using integral heating means H05K1/0212
• CPC Class Codes: Y10S 156/93 Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
• CPC Class Codes: Y10T 156/1179 with poking during delaminating [e.g., jabbing, etc.]
• CPC Class Codes: Y10T 428/1457 Silicon
• CPC Class Codes: Y10T 428/1495 Adhesive is on removable layer
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/2839 with release or antistick coating
• CPC Class Codes: Y10T 428/2848 Three or more layers

Abstract

Provision of a releasing layer transfer film which can form, in a simple manner, a releasing layer on a COF flexible printed wiring board, the releasing layer preventing melt adhesion of an insulating layer to a heating tool, thereby enhancing productivity and reliability of semiconductor devices produced by use of a semiconductor chip mounting line.

The releasing layer transfer film 1 for forming a releasing layer onto an insulating layer serving as a component layer of a COF flexible printed wiring board, the releasing layer transfer film includes a transfer film substrate 2 and a transferable releasing layer 3 provided on a surface of the transfer film substrate 2, wherein the transferable releasing layer 3 is formed from a releasing agent and can be transferred onto the insulating layer.

Claims

1. A releasing layer transfer film for forming a releasing layer onto an insulating layer serving as a component of a chip-on-film flexible printed wiring board, characterized in that the releasing layer transfer film comprises a transfer film substrate, and a transferable releasing layer provided on a surface of the transfer film substrate, wherein the transferable releasing layer is formed from a releasing agent comprising a silazane compound and can be transferred onto the insulating layer.

2. A releasing layer transfer film according to claim 1, wherein the transferable releasing layer is formed by applying a solution of the releasing agent onto the transfer film substrate, and heating.

3. A releasing layer transfer film according to claim 1, wherein the transferable releasing layer is transferred by firmly affixing the transferable releasing layer to the insulating layer, followed by heating.

4. A releasing layer transfer film according to claim 1, wherein the transferable releasing layer is provided on a surface of the transfer film substrate continuously or in the form of dispersed islands.

5. A releasing layer transfer film according to claim 1, wherein the transferable releasing layer is transferred onto the insulating layer continuously or in the form of dispersed islands.

6. A releasing layer transfer film according to claim 1, wherein the transferable releasing layer is provided so as to correspond to a region for forming a wiring pattern, the region intervening in at least two rows of sprocket holes of the COF flexible printed wiring board.

7. A releasing layer transfer film according to claim 6, wherein the COF flexible wiring board has at least two rows of wiring-pattern-formed regions, and the transferable releasing layer is shaped into a plurality strips corresponding to the wiring patterns.

8. A releasing layer transfer film according to claim 1, which has an adhesion layer between the transfer film substrate and the transferable releasing layer.

9. A releasing layer transfer film according to claim 1, wherein the transfer film substrate is affixed onto the insulating layer so as to serve as a reinforcing film during a production step of the COF flexible printed wiring board.

10. A releasing layer transfer film according to claim 1, which has, on a surface of the transferable releasing layer opposite to the transfer film substrate, a peelable film that can be peeled from the transferable releasing layer.

11. A laminate film, comprising a film substrate, a releasing layer provided on a surface of the film substrate, an insulating layer provided on the surface of the releasing layer opposite the side of the film substrate, and a conductor layer provided on the surface of the insulating layer opposite the side of the releasing layer, wherein the releasing layer is formed from a releasing agent containing at least one species selected from a silane compound, a silica sol and a silazane compound, and the insulating layer serves as a member of a COF flexible printed wiring board.

12. A laminate film according to claim 11, wherein the releasing layer is formed from a releasing agent containing a silazane compound.

13. A laminate film according to claim 11, which has an adhesion layer between the film substrate and the releasing layer.

14. A method for producing a COF flexible printed wiring board, the method comprising

laminating, onto an insulating layer serving as a component of a COF flexible printed wiring board, a releasing layer transfer film comprising a transfer film substrate, and a transferable releasing layer provided on a surface of the transfer film substrate, such that the transferable releasing layer is laminated on the insulating layer;

forming a wiring pattern from a layer provided on the surface of the insulating layer opposite the surface on which the releasing layer transfer film has been laminated to thereby produce a COF flexible printed wiring board; and

peeling the transfer film substrate, to thereby transfer the transferable releasing layer onto the insulating layer, whereby a COF flexible printed wiring board having a releasing layer on the insulating layer is produced;

wherein the releasing layer is formed from a releasing agent containing at least one species selected from a silane compound, a silica sol and a silazane compound, and the insulating layer serves as a member of a COF flexible printed wiring board.

15. A method for producing a COF flexible printed wiring board according to claim 14, wherein the releasing layer is transferred onto the insulating layer through heating before or while peeling the film substrate.

16. A method for producing a COF flexible printed wiring board according to claim 14, wherein the releasing layer is transferred onto a surface of the insulating layer continuously or in the form of dispersed islands.