Barrier layer made of a curable resin containing polymeric polyol
First Claim
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1. A component comprising a substrate, a layered structure arranged on the substrate, and a barrier layer arranged over the layered structure for protection against moisture, wherein the layered structure includes an optically active film and wherein the barrier layer comprises the reaction product of polymeric polyol in the form of polyvinyl butyral, and a curable epoxy resin, wherein the amount of polymeric polyol is in the range of from 1% to 30% by weight of the curable epoxy resin.
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Abstract
A component involving a substrate, a layered structure arranged on the substrate, and a barrier layer arranged over the layered structure, wherein the barrier layer has the reaction product of an epoxy resin and a polymeric polyol.
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Citations
21 Claims
- 1. A component comprising a substrate, a layered structure arranged on the substrate, and a barrier layer arranged over the layered structure for protection against moisture, wherein the layered structure includes an optically active film and wherein the barrier layer comprises the reaction product of polymeric polyol in the form of polyvinyl butyral, and a curable epoxy resin, wherein the amount of polymeric polyol is in the range of from 1% to 30% by weight of the curable epoxy resin.
- 15. A solar cell comprising a substrate, a layered structure arranged on the substrate, and a barrier layer arranged over the layered structure for protection against moisture, wherein the barrier layer comprises the reaction product of a polymeric polyol and an epoxy resin, and wherein the amount of polymeric polyol is in the range of from 1% to 30% by weight of the epoxy resin.
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21. A solar module comprising a substrate, a layered structure arranged on the substrate, and a barrier layer arranged over the layered structure for protection against moisture, wherein the barrier layer comprises the reaction product of a polymeric polyol and an epoxy resin, and wherein the amount of polymeric polyol is in the range of from 1% to 30% by weight of the epoxy resin.
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