Substrate manufacturing method and substrate processing apparatus

• US 7,256,104 B2
• Filed: 05/10/2004
• Issued: 08/14/2007
• Est. Priority Date: 05/21/2003
• Status: Expired due to Fees

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Miyabayashi, Hiroshi, Ito, Masataka, Tsuboi, Takashi, Yamagata, Kenji, Moriwaki, Ryuji, Takanashi, Kazuhito, Kakizaki, Yasuo
• Primary Examiner(s): THAI, LUAN C
• Application Number:
  US10/841,621
• Publication Number:
  US 20040259328A1
• Time in Patent Office: 1,191 Days
• Field of Search: 438/459, 438/455, 257/E21.567, 257/E21.568, 257/E21.569, 257/E21.57
• US Class Current: 438/459
• CPC Class Codes: H01L 21/02164 the material being a silicon oxide, e.g. SiO2
• CPC Class Codes: H01L 21/02238 silicon in uncombined form, i.e. pure silicon
• CPC Class Codes: H01L 21/30604 Chemical etching
• CPC Class Codes: H01L 21/31056 the removal being a selective chemical etching step, e.g. selective dry etching through a mask
• CPC Class Codes: H01L 21/31654 of semiconductor materials, e.g. the body itself
• CPC Class Codes: H01L 21/32134 by liquid etching only
• CPC Class Codes: H01L 21/6708 using mainly spraying means, e.g. nozzles
• CPC Class Codes: H01L 21/76254 with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
• CPC Class Codes: H01L 21/76259 with separation/delamination along a porous layer
• CPC Class Codes: H01L 22/12 for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions electrical measurement of diffusions H01L22/14
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Abstract

An SOI substrate which has a thick SOI layer is first prepared. Then, the SOI layer is thinned to a target film thickness using as a unit a predetermined thickness not more than that of one lattice. This thinning is performed by repeating a unit thinning step which includes an oxidation step of oxidizing the surface of the SOI layer by the predetermined thickness not more than that of one lattice and a removal step of selectively removing silicon oxide formed by the oxidation. The SOI layer of the SOI substrate is chemically etched by supplying a chemical solution to the SOI layer, and the film thickness of the etched SOI layer is measured. When the measured film thickness of the SOI layer has a predetermined value, a process of chemically etching the SOI layer ends.

Claims

1. A substrate manufacturing method comprising:

a preparation step of preparing a substrate which has a silicon layer on an insulating layer; and

a thinning step of thinning the silicon layer on the insulting layer to a desired thickness,

wherein in the thinning step, a unit thinning step including an oxidation step of oxidizing a surface of the silicon layer by a predetermined thickness, and a removal step of selectively removing silicon oxide formed in the oxidation step is performed not less than twice, and

wherein in the oxidation step, the silicon layer is oxidized in an atmosphere with an oxygen content adjusted so as to oxidize the surface of the silicon layer only by the predetermined thickness not more than a thickness of one lattice.

2. The method according to claim 1, wherein in the oxidation step, any one of a gas containing ozone, water containing ozone, a hydrogen peroxide solution, and nitric acid is supplied to the surface of the silicon layer.

3. The method according to claim 1, wherein in the oxidation step, the silicon layer is exposed to an atmosphere containing one of oxygen and ozone, and the surface of the silicon layer is irradiated with ultraviolet rays.

4. The method according to claim 1, wherein in the removal step, the silicon oxide formed in the oxidation step is removed using a hydrofluoric acid solution.

5. The method according to claim 1, wherein in the removal step, the silicon oxide formed in the oxidation step is completely removed.

6. The method according to claim 1, wherein an oxidizing agent used in the oxidation step is completely removed from the silicon oxide, prior to the removal step.

7. The method according to claim 1, further comprising as steps to be performed after the unit thinning step is repeated a predetermined number of times:

a measurement step of measuring a thickness of the silicon layer; and

a determination step of determining on the basis of a measurement result in the measurement step whether the silicon layer has the desired thickness,

wherein the unit thinning step is repeated until it is determined in the determination step that the silicon layer has the desired thickness.

8. The method according to claim 1, further comprising an annealing step of annealing the silicon layer in a reduction atmosphere prior to the thinning step.

9. The method according to claim 8, wherein the reduction atmosphere contains hydrogen.

10. The method according to claim 8, wherein the reduction atmosphere contains hydrogen and a rare gas.

11. The method according to claim 1, wherein the preparation step includes steps of:

bonding a silicon layer formed on a first member containing porous silicon to a second member through an insulating layer to form a bonded substrate stack; and

forming a substrate which has a silicon layer on an insulating layer by removing the first member from the bonded substrate stack.

12. The method according to claim 1, wherein the preparation step includes steps of:

implanting ions in a silicon member on which an insulating layer is formed to form an ion-implanted layer inside the silicon member;

bonding the silicon member to another member to form a bonded substrate stack; and

forming a substrate which has a silicon layer on an insulating layer by dividing the bonded substrate stack at the ion-implanted layer.

13. A substrate manufacturing method comprising:

a preparation step of preparing a substrate which has a silicon layer on an insulating layer; and

a thinning step of thinning the silicon layer on the insulting layer to a desired thickness,

wherein in the thinning step, a unit thinning step including an oxidation step of oxidizing a surface of the silicon layer by a predetermined thickness not more than a thickness of substantially one lattice and a removal step of selectively removing silicon oxide formed in the oxidation step is performed at least once.

14. A substrate manufacturing method comprising:

a preparation step of preparing a substrate which has a silicon layer on an insulating layer; and

a thinning step of thinning the silicon layer on the insulting layer to a desired thickness,

wherein in the thinning step, a unit thinning step including an oxidation step of oxidizing a surface of the silicon layer by a predetermined thickness, and a removal step of selectively removing silicon oxide formed in the oxidation step is performed not less than twice, and

the method further comprising a determination step of determining a repetition count of the unit thinning step required to thin the silicon layer to the desired thickness,

wherein the unit thinning step is repeated in accordance with the repetition count determined in the determination step.

15. A substrate manufacturing method comprising:

a preparation step of preparing a substrate which has a silicon layer on an insulating layer; and

a thinning step of thinning the silicon layer on the insulting layer to a desired thickness,

wherein in the thinning step, a unit thinning step including an oxidation step of oxidizing a surface of the silicon layer by a predetermined thickness, and a removal step of selectively removing silicon oxide formed in the oxidation step is performed not less than twice, and

the method further comprising;

a measurement step of measuring a thickness of the silicon layer; and

a determination step of determining the repetition count of the unit thinning step required to thin the silicon layer to the desired thickness, on the basis of a measurement result in the measurement step,

wherein the unit thinning step is repeated in accordance with the repetition count determined in the determination step.

16. The method according to claim 15, wherein the measurement step is performed prior to the unit thinning step for the first time.

17. A substrate manufacturing method comprising:

a preparation step of preparing a substrate which has a silicon layer on an insulating layer; and

a thinning step of thinning the silicon layer on the insulting layer to a desired thickness,

wherein in the thinning step, a unit thinning step including an oxidation step of oxidizing a surface of the silicon layer by a predetermined thickness, and a removal step of selectively removing silicon oxide formed in the oxidation step is performed not less than twice, and

the method further comprising;

a measurement step of measuring a thickness of the silicon layer; and

a determination step of determining on the basis of a measurement result in the measurement step whether the silicon layer has the desired thickness

wherein the unit thinning step is repeated until it is determined in the determination step that the silicon layer has the desired thickness.