Mask defect analysis system
First Claim
1. A method of evaluating the effect of defects on components in a semiconductor manufacturing process, said method comprising the steps of:
- inspecting a component for defects using an inspection tool;
recording defect inspection data from the inspection tool;
accessing design data from a design data repository corresponding to the component being inspected;
modifying said design data for the component according to said defect inspection data;
analyzing said modified design data;
classifying the defects into critical defects and the non-critical defects based on the analyzing; and
determining a final disposition of the component by applying different acceptance rules to the critical defects and the non-critical defects.
1 Assignment
0 Petitions
Accused Products
Abstract
An automated system for analyzing mask defects in a semiconductor manufacturing process is presented. This system combines results from an inspection tool and design layout data from a design data repository corresponding to each mask layer being inspected with a computer program and a predetermined rule set to determine when a defect on a given mask layer has occurred. Mask inspection results include the presence, location and type (clear or opaque) of defects. Ultimately, a determination is made as to whether to scrap, repair or accept a given mask based on whether the defect would be likely to cause product failure. Application of the defect inspection data to the design layout data for each mask layer being inspected prevents otherwise acceptable wafer masks from being scrapped when the identified defects are not in critical areas of the mask.
30 Citations
27 Claims
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1. A method of evaluating the effect of defects on components in a semiconductor manufacturing process, said method comprising the steps of:
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inspecting a component for defects using an inspection tool; recording defect inspection data from the inspection tool; accessing design data from a design data repository corresponding to the component being inspected; modifying said design data for the component according to said defect inspection data; analyzing said modified design data; classifying the defects into critical defects and the non-critical defects based on the analyzing; and determining a final disposition of the component by applying different acceptance rules to the critical defects and the non-critical defects. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 22, 23)
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11. A method of evaluating the effect of defects on masks for semiconductor wafers, said method comprising the steps of:
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inspecting a mask for defects using an inspection tool; recording defect inspection data from the inspection tool; accessing design data from a design data repository corresponding to a level of a mask layer being inspected; modifying said design data for said level of a mask layer according to said defect inspection data; analyzing said modified design data; classifying the defects into critical defects and non-critical defects based on the analyzing; and determining a final disposition of the mask by applying different acceptance rules to the critical defects and the non-critical defects. - View Dependent Claims (12, 13, 14, 15, 24, 25)
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16. A system for evaluating the effect of defects in masks for semiconductor wafers during pre-shipment inspection and pre-acceptance inspection of masks for semiconductor wafers, said system comprising:
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an inspection tool for inspecting a mask for defects; a recording medium for storing said defect inspection data from the inspection tool; a design data repository containing design level data for a level of a mask layer being inspected; a computer program for modifying said design data for said level of mask layer according to said defect inspection data; and a rule set for analyzing said modified design data to determine a final disposition of the mask according to previously established criteria, wherein the final disposition of the mask is determined after the defects are classified into critical defects and non-critical defects and by applying different acceptance rules to the critical defects and the non-critical defects. - View Dependent Claims (17, 18, 26, 27)
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19. A computer readable medium comprising code for causing a computer to implement steps of a method for evaluating the effect of defects on masks in a semiconductor manufacturing process, said method comprising:
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inspecting a mask for defects using an inspection tool; recording defect inspection data from the inspection tool; accessing design data from a design data repository corresponding to a level of a mask layer being inspected; modifying said design data for said level of a mask layer according to said defect inspection data; analyzing said modified design data; classifying the defects into critical defects and non-critical defects based on the analyzing; and determining a final disposition of the mask by applying different acceptance rules to the critical defects and the non-critical defects. - View Dependent Claims (20)
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21. A method of evaluating the effect of defects on components in a semiconductor manufacturing process, said method comprising:
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inspecting a component for defects using an inspection tool; storing defect inspection data from the inspection tool; generating shapes representing the defects; retrieving design data from a design data repository corresponding to the component being inspected; and performing an analysis using the design data, the generated shapes, and a pre-determined rule set to determine whether the defects are critical defects and non-critical defects, wherein a final disposition of the component is determined by applying different acceptance rules to the critical defects and the non-critical defects.
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Specification