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Mask defect analysis system

  • US 7,257,247 B2
  • Filed: 02/21/2002
  • Issued: 08/14/2007
  • Est. Priority Date: 02/21/2002
  • Status: Expired due to Fees
First Claim
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1. A method of evaluating the effect of defects on components in a semiconductor manufacturing process, said method comprising the steps of:

  • inspecting a component for defects using an inspection tool;

    recording defect inspection data from the inspection tool;

    accessing design data from a design data repository corresponding to the component being inspected;

    modifying said design data for the component according to said defect inspection data;

    analyzing said modified design data;

    classifying the defects into critical defects and the non-critical defects based on the analyzing; and

    determining a final disposition of the component by applying different acceptance rules to the critical defects and the non-critical defects.

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