Method for fabricating thick film alumina structures used in high frequency, low loss applications and a structure resulting therefrom
First Claim
Patent Images
1. A method for fabricating high frequency, low loss structures, the method comprising steps of:
- fabricating circuit layers on a first side of a first ceramic substrate to obtain a first circuit subassembly;
fabricating other circuit layers on a first side of a second ceramic substrate to obtain a second circuit subassembly;
printing a first metal layer on selected portions of a second side of the first ceramic substrate;
drying the first metal layer;
printing a second metal layer on selected portions of a second side of the second ceramic substrate;
drying the second metal layer;
printing a third metal layer on the second metal layer;
aligning the first metal layer with the third metal layer;
placing the first circuit subassembly on the second circuit subassembly to form a resultant assembly based on the aligning;
drying the third metal layer; and
,firing the resultant assembly, wherein the resultant assembly is a fiber optic transmitter.
1 Assignment
0 Petitions
Accused Products
Abstract
A method for fabricating thick film alumina structures used in high frequency, low loss applications is provided. More particularly, the invention is directed to a co-fire process for fabricating, or laminating, thick film structures to one another by printing a conductor layer between two thick film circuits, drying the layer, and co-firing the combined structure. This process is particularly useful in fabricating high frequency (e.g. 10 gigabit) fiber optic transmitters.
9 Citations
18 Claims
-
1. A method for fabricating high frequency, low loss structures, the method comprising steps of:
-
fabricating circuit layers on a first side of a first ceramic substrate to obtain a first circuit subassembly; fabricating other circuit layers on a first side of a second ceramic substrate to obtain a second circuit subassembly; printing a first metal layer on selected portions of a second side of the first ceramic substrate; drying the first metal layer; printing a second metal layer on selected portions of a second side of the second ceramic substrate; drying the second metal layer; printing a third metal layer on the second metal layer; aligning the first metal layer with the third metal layer; placing the first circuit subassembly on the second circuit subassembly to form a resultant assembly based on the aligning; drying the third metal layer; and
,firing the resultant assembly, wherein the resultant assembly is a fiber optic transmitter. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
-
-
12. A method for fabricating high frequency, low loss structures, the method comprising steps of:
-
printing a first metal layer on selected portions of a first ceramic substrate; drying the first metal layer; printing a second metal layer on selected portions of a second ceramic substrate; drying the second metal layer; printing a third metal layer on the second metal layer; aligning the first metal layer with the third metal layer; placing the first ceramic substrate on the second ceramic substrate to form a resultant assembly based on the aligning; drying the third metal layer; and
,firing the resultant assembly, wherein the resultant assembly is a fiber optic transmitter. - View Dependent Claims (13, 14, 15, 16, 17, 18)
-
Specification