Automated integrated circuit device manufacturing facility using central control

• US 7,257,458 B1
• Filed: 12/20/2005
• Issued: 08/14/2007
• Est. Priority Date: 12/20/2005
• Status: Active Grant

• Current Assignee: Advanced Micro Devices, Inc.
• Original Assignee: Advanced Micro Devices, Inc.
• Inventors: Markle, Richard J.
• Primary Examiner(s): Picard, Leo
• Assistant Examiner(s): Rapp, Chad
• Application Number:
  US11/313,196
• Time in Patent Office: 602 Days
• Field of Search: 700/97, 700/99, 700/108, 700/121, 438/5, 438/761
• US Class Current: 700/121
• CPC Class Codes: G05B 19/41865 characterised by job scheduling, process planning, material flow
• CPC Class Codes: G05B 2219/32051 Central control, modify program slave computers as function of production demand from host
• CPC Class Codes: G05B 2219/32266 Priority orders
• CPC Class Codes: G05B 2219/45031 Manufacturing semiconductor wafers
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

The present invention provides a method, an apparatus, and an automated semiconductor fabrication facility for determining control information based on global goals of a semiconductor manufacturing facility. The method includes accessing information indicative of at least one global goal of a semiconductor manufacturing facility, determining control information based on the at least one global goal, and providing a portion of the control information to each of a plurality of control units. Each of the plurality of control units is configured to control a corresponding manufacturing activity based on the provided portion of the control information.

Claims

1. A method, comprising:

accessing information indicative of at least one global goal of a semiconductor manufacturing facility;

determining control information based on said at least one global goal; and

providing a portion of the control information to each of a plurality of control units, each of the plurality of control units being configured to control a corresponding manufacturing activity based on the provided portion of the control information.

2. The method of claim 1, wherein accessing the information indicative of said at least one global goal comprises accessing information indicative of at least one of a priority and a constraint associated with at least one product produced by the semiconductor manufacturing facility.

3. The method of claim 2, wherein accessing information indicative of at least one of the priority and the constraint comprises accessing information indicative of at least one of a priority and a constraint determined based on at least one of a market demand for a product produced by the semiconductor manufacturing facility, a shipping commitment for a product produced by the semiconductor fabrication facility, and a lot request.

4. The method of claim 1, wherein providing the portion of the control information to each of the plurality of control units comprises providing at least one portion of the control information to a plurality of control units selected from a group consisting of a material handing controller, a run-to-run controller, a fault detection and control unit, a contamination free manufacture controller, an excursion controller, an exception controller, a data systems network controller, a planning system controller, and a controller associated with at least one type of processing tool.

5. The method of claim 1, further comprising accessing information associated with at least one of the plurality of control units.

6. The method of claim 5, wherein accessing information associated with the plurality of control units comprises accessing information indicative of at least one of a tool state, a wafer state, a fault condition, an exception, and an excursion.

7. The method of claim 5, wherein determining the control information comprises determining the control information based on said at least one global goal and said accessed information associated with the plurality of control units.

8. The method of claim 1, further comprising processing at least one wafer using the provided control information.

9. The method of claim 1, further comprising determining that at least one global goal has changed.

10. The method of claim 9, further comprising determining modified control information based on the changed global goal.

11. The method of claim 10, further comprising providing a portion of the modified control information to each of the plurality of control units.

12. The method of claim 11, further comprising processing at least one wafer using the portions of the modified control information.

13. An apparatus, comprising:

means for accessing information indicative of at least one global goal of a semiconductor manufacturing facility;

means for determining control information based on said at least one global goal; and

means for providing a portion of the control information to each of a plurality of control units, each of the plurality of control units being configured to control a corresponding manufacturing activity based on the provided portion of the control information.

14. An automated semiconductor manufacturing facility, comprising:

a plurality of control units configured to control a corresponding manufacturing activity based on control information; and

a central controller configured to;

access information indicative of at least one global goal of the semiconductor manufacturing facility;

determine control information based on said at least one global goal; and

provide the control information to at least one of the plurality of control units.

15. The automated semiconductor manufacturing facility of claim 14, wherein the central controller is configured to access information indicative of at least one of a priority and a constraint associated with at least one product produced by the semiconductor manufacturing facility.

16. The automated semiconductor manufacturing facility of claim 14, wherein the central controller is configured to access information indicative of at least one of a priority and a constraint determined based on at least one of a market demand for a product produced by the semiconductor manufacturing facility, a shipping commitment for a product produced by the semiconductor fabrication facility, and a lot request.

17. The automated semiconductor manufacturing facility of claim 14, wherein the central controller is configured to provide control information to at least one of a material handing controller, a run-to-run controller, a fault detection and control unit, a contamination free manufacture controller, an excursion controller, an exception controller, a data systems network controller, a planning system controller, and a controller associated with at least one type of processing tool.

18. The automated semiconductor manufacturing facility of claim 14, wherein the central controller is configured to access information associated with at least one of the plurality of control units.

19. The automated semiconductor manufacturing facility of claim 18, wherein the central controller is configured to access information indicative of at least one of a tool state, a wafer state, a fault condition, an exception, and an excursion.

20. The automated semiconductor manufacturing facility of claim 18, wherein the central controller is configured to determine the control information based on said at least one global goal and said accessed information associated with the plurality of control units.

21. The automated semiconductor manufacturing facility of claim 14, further comprising a plurality of processing tools associated with the plurality of control units and configured to process at least one wafer based on the control information provided to the associated control unit.

22. The automated semiconductor manufacturing facility of claim 14, wherein the central controller is configured to determine that at least one global goal has changed.

23. The automated semiconductor manufacturing facility of claim 22, wherein the central controller is configured to determine modified control information based on the changed global goal.

24. The automated semiconductor manufacturing facility of claim 23, wherein the central controller is configured to provide modified control information to each of the plurality of control units.

25. The automated semiconductor manufacturing facility of claim 24, wherein the plurality of processing tools are configured to processing at least one wafer based on the modified control information.