Multiple axis accelerometer

• US 7,258,011 B2
• Filed: 11/21/2005
• Issued: 08/21/2007
• Est. Priority Date: 11/21/2005
• Status: Active Grant

• Current Assignee: Invensense Incorporated (TDK Corporation)
• Original Assignee: Invensense Incorporated (TDK Corporation)
• Inventors: Nasiri, Steven S., Seeger, Joseph
• Primary Examiner(s): Kwok; Helen C.
• Application Number:
  US11/285,493
• Publication Number:
  US 20070113653A1
• Time in Patent Office: 638 Days
• Field of Search: 735/143.2, 735/143.6, 735/143.8, 735/142.9, 735/10, 735/11, 735/141.8, 735/142.4, 361/280
• US Class Current: 73/514.32
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: G01P 2015/082 for two degrees of freedom of movement of a single mass

Abstract

A sensor for measuring acceleration in three mutually orthogonal axes, X, Y and Z is disclosed. The sensor comprises a sensor subassembly. The sensor subassembly further comprises a base which is substantially parallel to the X-Y sensing plane; a proof mass disposed in the X-Y sensing plane and constrained to move substantially in the X, Y, and Z, about by at least one linkage and is responsive to accelerations in the X, Y and Z directions. The sensor includes at least one paddle disposed in the sensing plane; and at least one pivot on the linkage. Finally, the sensor includes at least one electrode at the base plate and at least one transducer for each sensing direction of the sensor subassembly responsive to the acceleration.

Claims

1. A sensor for measuring acceleration in three mutually orthogonal X, Y, and Z directions, the sensor comprising:

a first substrate including

a base which is substantially parallel to a X-Y sensing plane;

a proof mass disposed in the X-Y sensing plane and constrained to move substantially in the X, Y, and Z directions by a linkage, the proof mass being responsive to accelerations in the X, Y and Z directions;

a pivot on the linkage;

a paddle disposed in the X-Y sensing plane and attached to the linkage, the paddle being separate from the proof mass and being configured to rotate about a X axis or a Y axis along the pivot responsive to Z directional acceleration of the proof mass; and

a first plurality of electrodes fixed to the base and configured to respectively sense displacement of the proof mass responsive to X directional acceleration and Y directional acceleration of the proof mass; and

a second substrate including a second plurality of electrodes, the second plurality of electrodes configured to sense the Z directional acceleration of the proof mass.

2. The sensor of claim 1, wherein the first substrate comprises a plurality of paddles disposed in the X-Y sensing plane.

3. The sensor of claim 1, wherein the second plurality of electrodes are configured to sense the Z directional acceleration of the proof mass based on the rotation of the paddle about the X axis or the Y axis.

4. The sensor of claim 3, wherein the second plurality of electrodes comprise electrically isolated electrodes placed on opposite sides of a rotation axis of the paddle.

5. The sensor of claim 4, wherein the electrically isolated electrodes form a differential capacitive sensing transducer.

6. The sensor of claim 5, wherein the electrically isolated electrodes are all only on one side of the proof mass.

7. The sensor of claim 6, wherein the differential capacitive sensing transducer provides substantially equal and opposite capacitance changes.

8. The sensor of claim 6, wherein the differential capacitive sensing transducer comprises a reference capacitor having a constant capacitance.

9. The sensor of claim 5, wherein first plurality of electrodes are configured to respectively capacitively sense displacement of the proof mass responsive to X directional acceleration and Y directional acceleration of the proof mass.

10. The sensor of claim 9, wherein the first plurality of electrodes comprise a differential sense capacitor.

11. The sensor of claim 10, wherein the proof mass is substantially square in shape.

12. The sensor of claim 11, further comprising a first over-travel stop disposed in the X-Y sensing plane, the first over-travel stop to limit displacement of the proof mass in the X direction.

13. The sensor of claim 12, further comprising a second over-travel stop disposed in the X-Y sensing plane, the second over-travel stop limit displacement of the proof mass in the Y direction.

14. The sensor of claim 13, wherein the first over-travel stop and the second over-travel stop further limit displacement of the proof mass in the Z direction.

15. A sensor for measuring acceleration in three mutually orthogonal X, Y, and Z directions, the sensor comprising:

a first substrate including

a base which is substantially parallel to a X-Y sensing plane;

a proof mass disposed in the X-Y sensing plane and constrained to move substantially in the X, Y, and Z directions by a linkage, the proof mass being responsive to accelerations in the X, Y and Z directions;

a pivot on the linkage;

a paddle disposed in the X-Y sensing plane and attached to the linkage, the paddle being separate from the proof mass and being configured to rotate about a X axis or a Y axis along the pivot responsive to Z directional acceleration of the proof mass; and

a first plurality of electrodes fixed to the base and configured to respectively sense displacement of the proof mass responsive to X directional acceleration and Y directional acceleration of the proof mass, and

a silicon reference wafer comprising a second substrate, the silicon reference wafer having a top surface attached to the base of the first substrate, the second substrate including a second plurality of electrodes configured to sense the Z directional acceleration of the proof mass,

wherein the first substrate and the base are etched from a single silicon sensor wafer.

16. The sensor of claim 15, wherein the second plurality of electrodes are configured to sense the Z directional acceleration of the proof mass based on the rotation of the paddle about the X axis or the Y axis.

17. The sensor of claim 15, wherein the silicon reference wafer comprises CMOS electronics electrically connected to the first plurality of electrodes.

18. The sensor of claim 15, wherein the reference wafer includes a recess to accommodate motion of the proof mass.

19. The sensor of claim 18, wherein the first substrate comprises a plurality of paddles disposed in the X-Y sensing plane.

20. The sensor of claim 15, wherein the second plurality of electrodes are configured to sense the Z directional acceleration of the proof mass based on the rotation of the paddle about the X axis or the Y axis.

21. The sensor of claim 20, wherein the second plurality of electrodes comprise electrically isolated electrodes placed on opposite sides of a rotation axis of the paddle.

22. The sensor of claim 21, wherein the electrically isolated electrodes form a differential capacitive sensing transducer.

23. The sensor of claim 22, wherein the electrically isolated electrodes are all only on one side of the proof mass.

24. The sensor of claim 23, wherein the differential capacitive sensing transducer provides substantially equal and opposite capacitance changes.

25. The sensor of claim 23, wherein the differential capacitive sensing transducer comprises a reference capacitor having a constant capacitance.

26. The sensor of claim 22, wherein the first plurality of electrodes are configured to respectively capacitively sense displacement of the proof mass responsive to X directional acceleration and Y directional acceleration of the proof mass.

27. The sensor of claim 26, wherein the first plurality of electrodes comprise a differential sense capacitor.

28. The sensor of claim 27, wherein the proof mass is substantially square in shape.

29. The sensor of claim 28, further comprising a first over-travel stop disposed in the X-Y sensing plane, the first over-travel stop to limit displacement of the proof mass in the X direction.

30. The sensor of claim 29, further comprising a second over-travel stop disposed in the X-Y sensing plane, the second over-travel, stop to limit displacement of the proof mass in the Y direction.

31. The sensor of claim 30, wherein the first over-travel stop and the second over-travel stop further limit displacement of the proof mass in the Z direction.

32. A sensor for measuring acceleration in three mutually orthogonal X, Y, and Z directions, the sensor comprising:

a first including

a base which is substantially parallel to a X-Y sensing plane;

a proof mass disposed in the X-Y sensing plane and constrained to move substantially in the X, Y, and Z directions by a linkage, the proof mass being responsive to accelerations in the X, Y and Z directions;

a pivot on the linkage;

a paddle disposed in the X-Y sensing plane and attached to the linkage, the paddle being separate from the proof mass and being configured to rotate about a X axis or a Y axis alone the pivot responsive to Z directional acceleration of the proof mass; and

a first plurality of electrodes fixed to the base and configured to respectively sense displacement of the proof mass responsive to X directional acceleration and Y directional acceleration of the proof mass; and

a silicon reference wafer comprising a second substrate, the silicon reference wafer having a top surface attached to the base of the first substrate, the second substrate including a second plurality of electrodes configured to sense the Z directional acceleration of the proof mass,

wherein the first substrate and the base are etched from a single silicon sensor wafer; and

a cap wafer having a bottom surface attached to the base of the first substrate.

33. The sensor of claim 32 wherein the silicon reference wafer comprises CMOS electronics electrically connected to the first plurality of electrodes.

34. The sensor of claim 33, wherein the cap wafer comprises a recess to accommodate motion of the proof mass.

35. The sensor of claim 33, wherein:

the cap wafer is hermetically attached to the base; and

the silicon reference wafer is hermetically attached to the base.

36. The sensor of claim 33, wherein a gas pressure within a hermetic enclosure formed by the base, the cap wafer, and the silicon reference wafer is substantially different from atmospheric pressure.

37. The sensor of claim 33, wherein:

the cap wafer is hermetically attached to the base with a Si to SiO2 fusion bond; and

the silicon reference wafer is hermetically attached to the base with a metal seal.

38. The sensor of claim 32, wherein the first substrate comprises a plurality of paddles disposed in the X-Y sensing plane.

39. The sensor of claim 32, wherein the second plurality of electrodes are configured to sense the Z directional acceleration of the proof mass based on the rotation of the paddle about the X axis or the Y axis.

40. The sensor of claim 39, wherein the second plurality of electrodes comprise electrically isolated electrodes placed on opposite sides of a rotation axis of the paddle.

41. The sensor of claim 32, wherein the electrically isolated electrodes form a differential capacitive sensing transducer.

42. The sensor of claim 41, wherein the electrically isolated electrodes are all only on one side of the proof mass.

43. The sensor of claim 42, wherein the differential capacitive sensing transducer provides substantially equal and opposite capacitance changes.

44. The sensor of claim 42, wherein the differential capacitive sensing transducer comprises a reference capacitor having a constant capacitance.

45. The sensor of claim 41, wherein the first plurality of electrodes are configured to respectively capacitively sense displacement of the proof mass responsive to X directional acceleration and Y directional acceleration of the proof mass.

46. The sensor of claim 45, wherein the first plurality of electrodes comprise a differential sense capacitor.

47. The sensor of claim 46, wherein the proof mass is substantially square in shape.

48. The sensor of claim 47, further comprising a first over-travel stop disposed in the X-Y sensing plane, the first over-travel stop to limit displacement of the proof mass in the X direction.

49. The sensor of claim 48, further comprising a second over-travel stop disposed in the X-Y sensing plane, the second over-travel stop to limit displacement of the proof mass in the Y direction.

50. The sensor of claim 49, wherein the first over-travel stop and the second over-travel stop further limit displacement of the proof mass in the Z direction.