Method of making a microelectronic and/or optoelectronic circuitry sheet

• US 7,259,106 B2
• Filed: 09/09/2005
• Issued: 08/21/2007
• Est. Priority Date: 09/10/2004
• Status: Expired due to Fees

• Current Assignee: Versatilis, LLC
• Original Assignee: Versatilis, LLC
• Inventors: Jain, Ajaykumar R.
• Primary Examiner(s): Fahmy; Wael
• Assistant Examiner(s): Dolan; Jennifer M
• Application Number:
  US11/223,515
• Publication Number:
  US 20060063351A1
• Time in Patent Office: 711 Days
• Field of Search: 438/705, 438/734, 438/736, 438/737, 257/E21.023, 257/E21.024, 257/E21.027, 257/E21.037
• US Class Current: 438/737
• CPC Class Codes: G02F 1/133305 Flexible substrates, e.g. plastics, organic film
• CPC Class Codes: G02F 1/13613 the semiconductor element being formed on a first substrate and thereafter transferred to the final cell substrate
• CPC Class Codes: G02F 1/1362 Active matrix addressed cells G02F1/134336, G02F1/134363 take precedence
• CPC Class Codes: G02F 1/136231 for reducing the number of lithographic steps
• CPC Class Codes: G02F 1/1368 in which the switching element is a three-electrode device G02F1/136277 takes precedence
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/6835 used as a support during build up manufacturing of active devices
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/30105 Capacitance
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

A circuitry sheet (322) comprising an electronic device layer stack (304) containing electronic devices, e.g., thin-film transistors, or portions thereof, formed by removing material from both sides of the device layer stack. The circuitry sheet may be made by an electronic/optoelectronic device manufacturing method (200) that includes the steps of forming the device layer stack on a temporary substrate (300), removing material from both sides of the device layer stack, and then attaching a permanent substrate (348) to the device layer stack. The method uses one or more resist layers (600) that may be activated simultaneously and independently to impart distinct circuit pattern images (603, 608, 612) into each of a plurality of image levels (612, 616, 620) within each resist layer, thereby obviating repetitive sequential exposure, registration and alignment steps.

Claims

1. A method of manufacturing an electronic or optoelectronic circuitry sheet, comprising:

a) forming a device layer stack having a plurality of unpatterned device layers;

b) locating a resist layer in working relation with said device layer stack; and

c) activating said resist layer so as to impart a plurality of images distinct from one another at different imaging levels within said resist layer, wherein said plurality of images are imparted substantially simultaneously.

2. A method according to claim 1, wherein said resist layer is a single coating layer.

3. A method according to claim 1, wherein said resist layer comprises a plurality of resist coating layers activated by differing stimuli, and step c) includes activating said resist layer with energy comprising said differing stimuli so as to activate each of said plurality of resist coating layers substantially independently from each other.

4. A method according to claim 1, wherein step c) comprises stimulating said resist layer with a plurality of stimuli corresponding respectively to said plurality of images, said plurality of stimuli selected from the group consisting of electromagnetic energy, thermal energy, electric field energy, magnetic field energy, e-beam energy and sonic energy.

5. A method according to claim 1, further comprising performing steps a), b) and c) sequentially in a roll-to-roll process.

6. A method according to claim 5, further comprising performing steps a), b) and c) in forming at least parts of a plurality of corresponding respective thin film transistors.

7. A method according to claim 1, wherein step a) includes forming said device layer stack on a temporary substrate.

8. A method according to claim 7, further comprising, prior to step b), removing said temporary substrate.

9. A method according to claim 1, wherein the step of locating a resist layer includes locating a positive photoresist layer in working relation with said device stack.

10. A method according to claim 1, wherein the step of locating a resist layer includes locating a negative photoresist layer in working relation with said device stack.

11. A method according to claim 1, wherein the step of locating a resist layer includes locating a hybrid photoresist layer in working relation with said device stack.