High density front access device

• US 7,259,325 B2
• Filed: 02/22/2005
• Issued: 08/21/2007
• Est. Priority Date: 03/15/2004
• Status: Expired due to Fees

• Current Assignee: Microsemi Corp. - Analog Mixed Signal Group, Ltd. (Microchip Technology Incorporated)
• Original Assignee: Powerdsine Limited - Microsemi Corporation
• Inventors: Pincu, David, Epstein, Haim
• Primary Examiner(s): Estrada; Angel R.
• Application Number:
  US11/061,650
• Publication Number:
  US 20050201073A1
• Time in Patent Office: 910 Days
• Field of Search: 174/59, 174/50, 174/52.1, 174/15.2, 174/60, 174/DIG.9, 174/53, 174/57, 174/58, 174/68.1, 174/68.3, 174/520, 174/72.A, 361/797, 361/724, 361/600, 361/608, 361/610, 361/727, 361/728, 361/730, 361/752, 361/796, 361/829, 361/326, 220/3.2, 220/3.3, 220/3.4, 220/3.5, 220/3.6, 220/3.7, 220/3.8, 220/3.9, 220/4.02, 211/26, 248/200, 248/906, 385/134, 385/135
• US Class Current: 174/50
• CPC Class Codes: H04Q 1/02 Constructional details
• CPC Class Codes: H04Q 1/021 using pivoting mechanisms for accessing the interior of the apparatus
• CPC Class Codes: H04Q 1/023 using sliding mechanisms for accessing the interior of the apparatus
• CPC Class Codes: H04Q 1/09 Frames or mounting racks not otherwise provided for
• CPC Class Codes: H04Q 2201/02 Details of frames
• CPC Class Codes: H04Q 2201/08 Pivotable parts
• CPC Class Codes: H04Q 2201/10 Housing details
• CPC Class Codes: H05K 7/1448 with connections to the front board

Abstract

A high density device comprising: a chassis frame configured and dimensioned for mounting in a standardized telecommunications rack, the chassis frame defining a front plane and a back plane, the front plane being substantially coincident with a front support of the telecommunications rack; a sub-module chassis secured to the chassis frame, the sub-module chassis exhibiting a proximal face and a distal face; a first plurality of jacks located distal of the proximal face of the sub-module chassis; and a passageway formed between the sub-module chassis and an inner wall of the chassis frame, the passageway configured and dimensioned for the passage of cabling for connection to the first plurality of jacks.

Claims

1. A high density device comprising:

a chassis frame configured and dimensioned for mounting in a standardized telecommunications rack;

a sub-module chassis secured to said chassis frame, said sub-module chassis exhibiting a proximal face and a distal face;

a first plurality of jacks secured to said sub-module chassis and located distal of said proximal face of said sub-module chassis; and

a passageway defined between said sub-module chassis and an inner wall of said chassis frame, wherein said passageway enables the passage of cabling connected to said first plurality of jacks to a point substantially coplanar with said proximal face.

2. A high density device according to claim 1, further comprising a second plurality of jacks appearing on said proximal face of said sub-module chassis.

3. A high density device according to claim 2, further comprising a network management jack appearing on said proximal face of said sub-module chassis.

4. A high density device according to claim 1, wherein said first plurality of jacks appears on said distal face of said sub-module chassis.

5. A high density access device according to claim 4, wherein said sub-module chassis is slideably connected to said chassis frame, said sub-module chassis having a first position in which front access to said first plurality of jacks is not supplied, and a second extended position in which front access to said first plurality of jacks is provided.

6. A high density access device according to claim 4, wherein said sub-module chassis is pivotally connected to said chassis frame, said sub-module chassis having a first position in which front access to said first plurality of jacks is not supplied, and a second pivoted position in which front access to said first plurality of jacks is provided.

7. A high density access device according to claim 4, wherein said sub-module chassis is slideably and pivotally connected to said chassis frame, said sub-module chassis having a first position in which front access to said first plurality of jacks is not supplied, and a second extended and pivoted position in which front access to said first plurality of jacks is provided.

8. A high density access device according to claim 1, wherein said sub-module chassis is mounted in a drawer connected to said chassis frame.

9. A high density access device according to claim 1, wherein said sub-module chassis is removably secured to said chassis frame, said sub-module chassis being removed from said chassis frame to enable access to said first plurality of ports.

10. A high density access device according to claim 1, wherein said sub-module chassis is slideably connected to said chassis frame, said sub-module chassis having a first position in which front access to said first plurality of jacks is not supplied, and a second extended position in which front access to said first plurality of jacks is provided.

11. A high density access device according to claim 1, wherein said sub-module chassis is pivotally connected to said chassis frame, said sub-module chassis having a first position in which front access to said first plurality of jacks is not supplied, and a second pivoted position in which front access to said first plurality of jacks is provided.

12. A high density access device according to claim 1, wherein said sub-module chassis is slideably and pivotally connected to said chassis frame, said sub-module chassis having a first position in which front access to said first plurality of jacks is not supplied, and a second extended and pivoted position in which front access to said first plurality of jacks is provided.

13. A high density front access device according to claim 1, wherein said first plurality of jacks substantially define a plane, said plane being located proximal of point half way between a front plane defined by said chassis frame and a back plane defined by said chassis frame.

14. A high density front access device according to claim 1, wherein said first plurality of jacks comprise at least one RJ-45 jack.

15. A high density front access device according to claim 1, wherein said first plurality of jacks comprise at least one of a telecom jack and an Amp Champ jack.

16. A high density device according to claim 1, further comprising a power supply, said power supply being connected to said chassis frame distal of said proximal face of said sub-module chassis.

17. A high density front access device according to claim 1, wherein said chassis frame exhibits a flange, said flange at least partially defining said passageway.

18. A high density front access device according to claim 1, wherein the device comprises midspan power insertion equipment supporting at least 40 ports.

19. A high density front access device according to claim 1, further comprising a network management jack.

20. A high density front access device according to claim 19, wherein said network management jack appears on said distal face of said sub-module chassis.

21. An apparatus for connecting a plurality of cables, the apparatus comprising:

a chassis frame arranged for mounting in a standardized telecommunications rack, said chassis frame exhibiting a front and a back;

a sub-module chassis connected to said chassis frame, said sub-module chassis exhibiting a proximal face and a distal face, said proximal face of said sub-module chassis exhibiting unobstructed access from said chassis frame front when said chassis frame is mounted in the standardized telecommunications rack;

a first plurality of jacks secured to said sub-module chassis and exhibiting unobstructed access from said chassis frame front; and

a second plurality of jacks secured in relation to said chassis frame and located distal of said proximal face of said sub-module chassis and proximal of said back of said chassis frame; and

a passageway formed between said sub-module chassis and said chassis frame, wherein said passageway enables the passage of at least one cable connected to said second plurality of jacks to a point substantially coplanar with said proximal face.

22. An apparatus according to claim 21, wherein at least one of said second plurality of jacks is secured to said sub-module chassis.

23. An apparatus for connecting a plurality of cables, the apparatus comprising:

a chassis frame configured and dimensioned for mounting in a standardized telecommunications rack, said chassis frame defining a front and a back;

a sub-module chassis connected to said chassis frame, said sub-module chassis exhibiting a front and a back;

a first plurality of jacks secured to said sub-module chassis, said first plurality of jacks facing said back of said chassis frame;

a second plurality of jacks secured to said sub-module chassis, said second plurality of jacks facing said front of said chassis frame; and

a passageway formed between said sub-module chassis and said chassis frame, said passageway arranged to enable the passage of at least one cable connected to said first plurality of jacks to a point substantially coplanar with said front of said chassis frame.

24. A midspan power insertion module comprising:

a chassis frame configured and dimensioned for mounting in a standardized telecommunications rack;

a sub-module chassis secured to said chassis frame, said sub-module chassis exhibiting a proximal face and a distal face;

a first plurality of jacks supporting at least 40 ports located distal of said proximal face of said sub-module chassis;

a second plurality of jacks supporting at least 40 ports appearing on said proximal face of said sub-module chassis; and

a passageway formed between said sub-module chassis and an inner wall of said chassis frame, said passageway arranged to enable the passage of cabling connected to said first plurality of jacks to a point substantially coplanar with said proximal face of said sub-module chassis.