×

Vertical interconnect for organic electronic devices

  • US 7,259,391 B2
  • Filed: 12/22/2004
  • Issued: 08/21/2007
  • Est. Priority Date: 12/22/2004
  • Status: Expired due to Fees
First Claim
Patent Images

1. A device comprising:

  • a plurality of organic electronic devices disposed on a substrate, wherein each of the organic electronic devices comprises a first electrode and a second electrode;

    an organic layer disposed between the first and second electrodes of each of the plurality of organic electronic devices; and

    an interconnect element, wherein the interconnect element comprises an interconnect layer, and wherein the interconnect layer comprises a non-conductive matrix having conductive fillers disposed therethrough, and wherein the conductive fillers protruding out of the non-conductive matrix are electrically coupled to one of the first or second electrode of each of the plurality of organic electronic devices.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×