Micromechanical component and corresponding production method
First Claim
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1. A micromechanical component, comprising:
- a substrate;
a micromechanical functional plane provided on the substrate;
a covering plane provided on the micromechanical functional plane; and
a printed circuit trace plane provided on the covering plane;
wherein the covering plane includes a first monocrystalline region epitaxially grown on an underlying second monocrystalline region and a first polycrystalline region epitaxially grown on an underlying first polycrystalline starting layer, wherein the first monocrystalline region and the first polycrystalline region are adjacent to and coplanar with one another in a side by side manner.
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Abstract
A micromechanical component includes: a substrate; a micromechanical functional plane provided on the substrate; a covering plane provided on the micromechanical functional plane; and a printed circuit trace plane provided on the covering plane. The covering plane includes a monocrystalline region which is epitaxially grown on an underlying monocrystalline region, and the covering plane includes a polycrystalline region which is epitaxially grown on an underlying polycrystalline starting layer at the same time.
16 Citations
10 Claims
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1. A micromechanical component, comprising:
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a substrate; a micromechanical functional plane provided on the substrate; a covering plane provided on the micromechanical functional plane; and a printed circuit trace plane provided on the covering plane; wherein the covering plane includes a first monocrystalline region epitaxially grown on an underlying second monocrystalline region and a first polycrystalline region epitaxially grown on an underlying first polycrystalline starting layer, wherein the first monocrystalline region and the first polycrystalline region are adjacent to and coplanar with one another in a side by side manner. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method for manufacturing a micromechanical component, comprising the steps of:
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providing a substrate; providing a micromechanical functional plane on the substrate; providing a covering plane on the micromechanical functional plane; providing a polysilicon starting layer region-wise on the micromechanical functional plane and leaving open region-wise a first monocrystalline region of the micromechanical functional plane; epitaxially depositing a second monocrystalline region on the first monocrystalline region left open and epitaxially depositing a polycrystalline region on the polysilicon starting layer at the same time, wherein the second monocrystalline region and the polycrystalline region are adjacent to and coplanar with one another in a side by side manner; and providing a printed circuit trace plane on the covering plane.
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Specification