Lithographic apparatus and device manufacturing method
First Claim
Patent Images
1. A lithographic apparatus, comprising:
- an illumination system that supplies a beam of radiation;
an array of individually controllable elements that pattern the beam;
a projection system that projects the patterned beam onto a target portion of a substrate; and
a controller that controls a pattern formed using the array of individually controllable elements using (a) intended pattern data, which corresponds to a pattern to be exposed on the substrate, and (b) processing conditions data, which corresponds to at least one processing condition of the substrate, wherein the controller controls a size of at least one feature of the pattern relative to a size of the pattern specified by the intended pattern data based on the processing condition data.
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Abstract
A lithographic apparatus is provided that uses an array of individually controllable elements to pattern the beam of radiation. The critical dimension uniformity of a substrate patterned using the apparatus is improved by adjusting the pattern data provided to the array of individually controllable elements to compensate for process variation.
30 Citations
22 Claims
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1. A lithographic apparatus, comprising:
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an illumination system that supplies a beam of radiation; an array of individually controllable elements that pattern the beam; a projection system that projects the patterned beam onto a target portion of a substrate; and a controller that controls a pattern formed using the array of individually controllable elements using (a) intended pattern data, which corresponds to a pattern to be exposed on the substrate, and (b) processing conditions data, which corresponds to at least one processing condition of the substrate, wherein the controller controls a size of at least one feature of the pattern relative to a size of the pattern specified by the intended pattern data based on the processing condition data. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A device manufacturing methods, comprising:
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forming a pattern with an array of individually controllable elements using (1) intended pattern data, which corresponds to a pattern to be exposed on the substrate, and (2) processing conditions data, which corresponds to at least one processing condition of the substrate, wherein the processing conditions data controls a size of at least one feature of the pattern relative to a size of the pattern specified by the intended pattern; patterning a beam of radiation using the formed patterned on the array of individually controllable elements; and projecting the patterned beam onto a target portion of a substrate.
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13. A lithographic apparatus, comprising:
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an illumination system configured to supply a beam of radiation; an array of individually controllable elements configured to pattern the beam of radiation,; a projection system that projects the patterned beam onto a target portion of a substrate; and a controller configured to set an intensity of the patterned beam to any one of at least three intensity levels and to control a pattern formed using the array of individually controllable elements using (a) intended pattern data, which corresponds to a pattern to be exposed on the substrate, and (b) processing conditions data, which corresponds to at least one processing condition of the substrate, wherein the controller is configured to also control which of the at least three intensity levels at least one feature of the pattern in the patterned beam is set to relative to an intensity level specified for the at least one feature in the intended pattern data based on the processing conditions data. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21)
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22. A lithographic method, comprising:
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controlling a pattern formed by an array of individually controllable elements using (1) intended pattern data, which corresponds to a pattern to be exposed on the substrate, and (2) processing conditions data, which corresponds to at least one processing condition of the substrate, wherein the processing conditions data determines which one of at least three intensity levels of the beam to use for at least one feature in the intended pattern data; patterning a beam of radiation using the formed patterned; and projecting the patterned beam onto a target portion of a substrate.
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Specification