Semiconductor light-emitting apparatus having wavelength conversion portion and method of fabricating the same

• US 7,260,123 B2
• Filed: 12/17/2004
• Issued: 08/21/2007
• Est. Priority Date: 12/26/2003
• Status: Active Grant

• Current Assignee: Stanley Electric Company Limited
• Original Assignee: Stanley Electric Company Limited
• Inventors: Sato, Hiroyuki
• Primary Examiner(s): Rodriguez; Armando
• Application Number:
  US11/013,362
• Publication Number:
  US 20050139851A1
• Time in Patent Office: 977 Days
• Field of Search: 372/22, 257/79
• US Class Current: 372/22
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2933/0091 Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/504 Elements with two or more wavelength conversion materials
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin

Abstract

A semiconductor light-emitting apparatus which has a simple structure can include a base having a concave portion having an upward opening, a semiconductor light-emitting device placed on the bottom of the concave portion, and a wavelength conversion portion for converting the wavelength of light emitted from the semiconductor light-emitting device. The wavelength conversion portion can include first and second wavelength conversion layers formed on the bottom of the concave portion and in the opening thereof at a distance above the device, respectively. A space defined by the base having the concave portion and the second wavelength conversion layer can be provided with a sealing portion containing a material for transmitting the light emitted from the semiconductor device and light that is emitted from the first and second wavelength conversion layers.

Claims

1. A semiconductor light-emitting apparatus comprising:

a base having a concave portion with a bottom and an opening;

a pair of electrodes located adjacent the bottom of the concave portion;

a semiconductor light-emitting device located adjacent the bottom of the concave portion and being electrically connected with the pair of electrodes;

a wavelength conversion portion capable of changing the wavelength of light emitted from the semiconductor light-emitting device, wherein the wavelength conversion portion includes a first wavelength conversion layer formed adjacent the bottom of the concave portion and a second wavelength conversion layer formed in the opening of the concave portion and at a distance above the semiconductor light-emitting device; and

a space defined by the base and the second wavelength conversion layer, the space being provided with a sealing portion containing a material capable of substantially transmitting the light emitted from the semiconductor light-emitting device and wavelength conversion light emitted from the first and second wavelength conversion layers, wherein

the first wavelength conversion layer is formed in a bottom portion of the sealing portion.

2. The semiconductor light-emitting apparatus according to claim 1, wherein a top surface of the sealing portion located substantially directly above the semiconductor light-emitting device includes a recessed portion that is recessed toward the semiconductor light-emitting device.

3. The semiconductor light-emitting apparatus according to claim 1, wherein at least one of the first wavelength conversion layer and the second wavelength conversion layer includes at least one type of phosphor selected from the group consisting of:

phosphors having the composition of A₃B₅O₁₂;

M, where A includes at least one element selected from among Y, Gd, Lu, and Tb, B includes at least one element selected from Al and Ga, and M includes at least one ion selected from among Ce³⁺, Tb³⁺, Eu³⁺, Cr³⁺, Nd³⁺, and Er³⁺;

rare-earth doped barium-aluminum-magnesium compound phosphors;

sulfide compound phosphors;

rare-earth doped thiogallate phosphors; and

aluminate phosphors.

4. The semiconductor light-emitting apparatus according to claim 1, wherein the material of the sealing portion includes at least one resin selected from the group consisting of:

epoxy resins;

silicone resins;

polydimethylsiloxane derivatives having epoxy groups;

oxetane resins;

acryl resins; and

cycloolefin resins.

6. The semiconductor light-emitting apparatus according to claim 1, wherein the first wavelength conversion layer is formed on a top surface of the semiconductor light-emitting device located adjacent the bottom of the concave portion.

12. The semiconductor light-emitting apparatus according to claim 1, wherein the concave portion is formed as a truncated cone.

13. The semiconductor light-emitting apparatus according to claim 1, wherein the concave portion is formed as one of an inverted pyramid, a rectangular box, and a portion of a hemisphere.

14. The semiconductor light-emitting apparatus according to claim 1, wherein the first wavelength conversion layer includes a wavelength conversion material located in a bottom portion of the sealing portion, wherein the wavelength conversion material is more dense at a location near the bottom of concave portion as compared to a location distanced from the bottom of the concave portion.

15. The semiconductor light-emitting apparatus according to claim 1, wherein the first wavelength conversion layer includes a wavelength-conversion-material-containing sheet.

5. A semiconductor light-emitting apparatus comprising:

a base having a concave portion with a bottom and an opening;

a pair of electrodes located adjacent the bottom of the concave portion;

a semiconductor light-emitting device located adjacent the bottom of the concave portion and being electrically connected with the pair of electrodes;

a wavelength conversion portion capable of changing the wavelength of light emitted from the semiconductor light-emitting device, wherein the wavelength conversion portion includes a first wavelength conversion layer formed adjacent the bottom of the concave portion and a second wavelength conversion layer formed in the opening of the concave portion and at a distance above the semiconductor light-emitting device; and

a space defined by the base and the second wavelength conversion layer, the space being provided with a sealing portion containing a material capable of substantially transmitting the light emitted from the semiconductor light-emitting device and wavelength conversion light emitted from the first and second wavelength conversion layers, wherein

the second wavelength conversion layer is formed to cover the entire opening of the concave portion.

7. A method of fabricating a semiconductor light-emitting apparatus comprising:

providing a base having a concave portion with a bottom, a pair of electrodes, a semiconductor light-emitting device located adjacent the bottom of the concave portion and being electrically connected with the pair of electrodes, a wavelength conversion portion configured to change the wavelength of light emitted from the semiconductor light-emitting device, and a sealing portion having a constituent material and being located adjacent the concave portion;

loading the semiconductor light-emitting device onto the concave portion of the base so as to be electrically connected with the pair of electrodes;

forming a first wavelength conversion layer configured to perform as the wavelength conversion portion on the bottom of the concave portion;

injecting the constituent material of the sealing portion into the concave portion;

hardening the constituent material of the sealing portion to form the sealing portion; and

forming a second wavelength conversion layer configured to perform as the wavelength conversion portion on the sealing portion, wherein

forming a first wavelength conversion layer includes forming the first wavelength conversion layer along a substantially flat planar portion of the bottom of the concave portion.

8. The method of fabricating a semiconductor light-emitting apparatus according to claim 7, wherein forming the first wavelength conversion layer includes applying a wavelength conversion material to the bottom of the concave portion to form the first wavelength conversion layer.

9. The method of fabricating a semiconductor light-emitting apparatus according to claim 7, wherein forming the first wavelength conversion layer includes placing a wavelength-conversion-material-containing sheet that has a predetermined thickness and a wavelength conversion material at a predetermined density on the concave portion to form the first wavelength conversion layer.

16. The method of fabricating a semiconductor light-emitting apparatus according to claim 7, wherein forming the first wavelength conversion layer includes forming the first wavelength conversion layer on both the bottom surface of the concave portion and a top surface of the semiconductor light emitting device.

17. The method of fabricating a semiconductor light-emitting apparatus according to claim 7, wherein the concave portion of the base forms an opening, and forming the second wavelength conversion layer includes forming the second wavelength conversion layer such that it covers the entire opening of the concave portion.

10. A method of fabricating a semiconductor light-emitting apparatus comprising:

providing a base having a concave portion with a bottom, a pair of electrodes, a semiconductor light-emitting device located adjacent to the bottom of the concave portion and being electrically connected with the pair of electrodes, a wavelength conversion portion configured to change the wavelength of light emitted from the semiconductor light-emitting device, and a sealing portion;

loading the semiconductor light-emitting device onto the concave portion of the base so as to be electrically connected with the pair of electrodes;

injecting a mixed material into the concave portion, the mixed material being a mixture of a material for forming the sealing portion and a wavelength conversion material for forming the wavelength conversion portion;

densifying the wavelength conversion material along a substantially flat planar portion of a bottom area of the concave portion so that a part of the bottom area of the concave portion where the wavelength conversion material is densified creates a first wavelength conversion layer configured to perform as the wavelength conversion portion;

forming the sealing portion by hardening the mixed material in the concave portion where the first wavelength conversion layer is formed; and

forming a second wavelength conversion layer configured to perform as the wavelength conversion portion on the sealing portion.

11. The method of fabricating a semiconductor light-emitting apparatus according to claim 10, wherein forming the first wavelength conversion layer includes allowing the wavelength conversion material to settle out by its own weight so that the wavelength conversion material is densified in the bottom area of the concave portion.

18. A method of fabricating a semiconductor light-emitting apparatus comprising:

providing a base having a concave portion with a bottom, a pair of electrodes, a semiconductor light-emitting device located adjacent to the bottom of the concave portion and being electrically connected with the pair of electrodes, a wavelength conversion portion configured to change the wavelength of light emitted from the semiconductor light-emitting device, and a sealing portion;

loading the semiconductor light-emitting device onto the concave portion of the base so as to be electrically connected with the pair of electrodes;

injecting a mixed material into the concave portion, the mixed material being a mixture of a material for forming the sealing portion and a wavelength conversion material for forming the wavelength conversion portion;

densifying the wavelength conversion material in a bottom area of the concave portion so that a part of the bottom area of the concave portion where the wavelength conversion material is densified creates a first wavelength conversion layer configured to perform as the wavelength conversion portion;

forming the sealing portion by hardening the mixed material in the concave portion where the first wavelength conversion layer is formed; and

forming a second wavelength conversion layer configured to perform as the wavelength conversion portion on the sealing portion, wherein

forming the first wavelength conversion layer includes forming the first wavelength conversion layer on both the bottom surface of the concave portion and a top surface of the semiconductor light emitting device.