Information containing means for memory modules and memory chips

• US 7,260,671 B2
• Filed: 10/23/2002
• Issued: 08/21/2007
• Est. Priority Date: 10/26/2001
• Status: Expired due to Fees

• Current Assignee: Polaris Innovations Limited (Wi-LAN Inc.)
• Original Assignee: Infineon Technologies AG
• Inventors: Stocken, Christian, Wirth, Norbert, Taskin, Nazif, Cordes, Eric
• Primary Examiner(s): Bataille; Pierre
• Assistant Examiner(s): TSAI, SHENG JEN
• Application Number:
  US10/278,232
• Publication Number:
  US 20030081444A1
• Time in Patent Office: 1,763 Days
• Field of Search: 711/2, 711/5, 711/101, 711/102, 711/103, 711/104, 711/156, 711/170
• US Class Current: 711/103
• CPC Class Codes: G11C 16/20 Initialising; Data preset; Chip identification
• CPC Class Codes: G11C 5/04 Supports for storage elements , e.g. memory modules; Mounting or fixing of storage elements on such supports
• CPC Class Codes: G11C 7/1045 Read-write mode select circuits
• CPC Class Codes: G11C 7/20 Memory cell initialisation circuits, e.g. when powering up or down, memory clear, latent image memory

Abstract

A memory module includes at least one memory chip arranged on the memory module. Information about the memory module and/or the at least one memory chip arranged on the memory module can be stored directly on the memory chip, making use of a suited element, fuses or flip-flops, for example. A memory chip contains such an element for containing information relating to the memory chip and/or a memory module with which the memory chip is compatible, wherein the information containing element can be read out by means of an external processor.

Claims

1. A memory module comprising:

a plurality of memory chips arranged on the memory module; and

information containing means containing a common set of information relating to the memory module and/or the memory chips arranged on the memory module, said common set of information being valid for all of the plurality of memory chips;

said information containing means being arranged on the memory chips;

said common set of information contained in the information containing means relating to operational parameters of the memory module or the memory chips and/or to manufacturer-specific data of the memory module and/or the memory chips; and

said information containing means being distributed among the plurality of memory chips so that each memory chip has stored thereon, different information of said common set of information, such that the different information distributed among the plurality of memory chips, when taken together, forms the complete common set of information.

2. The memory module according to claim 1, wherein the information containing means comprises fuses for permanently programming information.

3. The memory module according to claim 1, wherein the information containing means comprises flip-flops.

4. A memory module comprising:

a plurality of memory chips arranged on the memory module; and

information containing means containing a common set of information relating to the memory module and the memory chips arranged on the memory module, said common set of information being valid for all of the plurality of memory chips;

said information containing means being arranged on the memory chips;

said common set of information contained in the information containing means relating to operational parameters of the memory module or the memory chips and/or to manufacturer-specific data of the memory module and/or the memory chips; and

said information containing means being distributed among the plurality of memory chips so that each memory chip has stored thereon, a different fraction of said common set of information, such that the fractions taken together form the complete common set of information.

5. The memory module according to claim 4, wherein the information containing means includes fuses for permanently programming information.

6. The memory module according to claim 4, wherein the information containing means includes flip-flops.

7. A memory module comprising:

a plurality of memory chips arranged on the memory module; and

information containing means containing a common set of information relating to the memory module and/or the memory chips arranged on the memory module, said common set of information being valid for all of the plurality of memory chips;

said information containing means being arranged on the memory chips;

said common set of information contained in the information containing means including manufacturerspecific data of the memory module and/or the memory chips; and

said information containing means being distributed among the plurality of memory chips so that each memory chip has stored thereon, a different fraction of said common set of information, such that the fractions taken together form the complete common set of information.

8. The memory module according to claim 7, wherein the information containing means includes fuses for permanently programming information.

9. The memory module according to claim 7, wherein the information containing means includes flip-flops.