Semiconductor device with speed binning test circuit and test method thereof
First Claim
1. A speed binning test circuit, comprising:
- a plurality of circuit groups arranged along a boundary of a chip circuit, each circuit group including a different number of unit delay circuits with respect to each other;
a plurality of pads, each pad disposed between two adjacent circuit groups of the plurality of circuit groups, wherein each of the pads is connected to at least one output terminal of one of the two adjacent circuit groups and also connected to at least one input terminal of the other of the two adjacent circuit groups; and
wherein the circuit groups comprise combinational circuits.
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Accused Products
Abstract
A speed binning test circuit for a semiconductor device may include a plurality of circuit groups arranged along a boundary of a chip circuit. Each circuit group may include a different number of unit delay circuits that may form a chain structure. The speed binning test circuit may also include a plurality of pads. Each pad may be arranged between a pair of circuit groups so that at least one output terminal of a unit delay circuit of one of the plurality of circuit groups is connected to one of the pads. The speed binning test device performs a speed binning test method in which a signal through the circuit groups is delayed, and on-chip-variations are monitored to determine a total signal delay time through the chain structure.
16 Citations
22 Claims
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1. A speed binning test circuit, comprising:
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a plurality of circuit groups arranged along a boundary of a chip circuit, each circuit group including a different number of unit delay circuits with respect to each other; a plurality of pads, each pad disposed between two adjacent circuit groups of the plurality of circuit groups, wherein each of the pads is connected to at least one output terminal of one of the two adjacent circuit groups and also connected to at least one input terminal of the other of the two adjacent circuit groups; and wherein the circuit groups comprise combinational circuits. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A semiconductor device, comprising:
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a plurality of signal input/output pins; a core circuit including logic that receives or outputs a signal via the plurality of signal input/output pins; and a speed binning test circuit including; a plurality of circuit groups, each circuit group including a different number of unit delay circuits with respect to each other arranged in a chain structure along the boundary of the core circuit, a plurality of pads, each pad disposed between two adjacent circuit groups of the plurality of circuit groups, wherein each of the pads is connected to at least one output terminal of one of the two adjacent circuit groups and also connected to at least one input terminal of the other of the two adjacent circuit groups;
andwherein the circuit groups comprise combinational circuits. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A speed binning test method, comprising:
- delaying test signals through a plurality of successively connected circuit groups, each of the plurality of successively connected circuit groups including different number of unit delay circuits with respect to each other, that forms a chain structure on a chip,
monitoring on-chip-variations to determine total signal delay time through the chain structure at a plurality of pads, each pad disposed between two adjacent circuit groups of the plurality of circuit groups, wherein each of the pads is connected to at least one output terminal of one of the two adjacent circuit groups and also connected to at least one input terminal of the other of the two adjacent circuit groups; and wherein the circuit groups comprise combinational circuits. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22)
- delaying test signals through a plurality of successively connected circuit groups, each of the plurality of successively connected circuit groups including different number of unit delay circuits with respect to each other, that forms a chain structure on a chip,
Specification