Bubble generator

• US 7,261,144 B2
• Filed: 09/14/2004
• Issued: 08/28/2007
• Est. Priority Date: 06/18/2004
• Status: Expired due to Fees

• Current Assignee: Ecole polytechnique fãdãrale de lausanne epfl (Schweizerische Eidgenossenschaft)
• Original Assignee: Ecole polytechnique fãdãrale de lausanne epfl (Schweizerische Eidgenossenschaft)
• Inventors: Thome, John R., Dupont, Vincent
• Primary Examiner(s): Duong; Tho
• Application Number:
  US10/940,391
• Publication Number:
  US 20050279491A1
• Time in Patent Office: 1,078 Days
• Field of Search: 165/104.23, 165/104.24, 165/104.21, 165/104.29, 165/104.33, 165/274, 165/287, 165/80.4, 361699-700, 347 54- 55, 347/61, 347/14, 347 17- 18
• US Class Current: 165/104.29
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 15/06 Control arrangements therefor
• CPC Class Codes: F28F 2250/08 Fluid driving means, e.g. pumps, fans
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat transfer assembly for transferring heat from a heat generating device to a circulating fluid, said heat transfer assembly comprising

• • an evaporator device having at least one microchannel formed therein, in thermally conductive contact with said heat generating device,
  • a condenser device,
  • actuating means and manifold means for circulating said fluid between said evaporator device and said condenser device,
  • wherein said heat transfer assembly further comprises a bubble generator capable to create bubbles in said at least one microchannel at a controlled frequency.

Claims

1. A heat transfer assembly for transferring heat from a heat generating device to a circulating fluid, said heat transfer assembly comprising

an evaporator device having at least one microchannel formed therein, in thermally conductive contact with said heat generating device,

a condenser device,

actuating means and manifold means for circulating said fluid between said evaporator device and said condenser device,

wherein said heat transfer assembly further comprises a bubble generator for generating bubbles within a tubular or channel liquid flow, comprising

means for generating one bubble at a pre-determined location within said tubular or channel liquid flow,

means for repeating periodically said bubble generating step at said location, and

means for controlling the frequency of said periodical bubble generating step,

wherein said tubular or channel liquid flow is carried out within said microchannel, and wherein said bubbles consist of vapor of said liquid.

2. An assembly as claimed in claim 1, wherein said frequency is a pre-determined fixed frequency of between 5 Hz and 500 Hz.

3. An assembly as claimed in claim 1, wherein said frequency is adjustable between 5 Hz and 500 Hz.

4. An assembly as claimed in claim 3, wherein said frequency is adjustable upon a temperature measurement.

5. An assembly as claimed in claim 1 comprising wire means for connecting said bubble generating means to a control circuit providing periodically varying electric energy and transducer means connected to said wire means, capable to transfer said electric energy to said liquid in form of thermal and/or mechanical energy.

6. An assembly as claimed in claim 5, wherein said transducer means comprise an electrically resistive part.

7. An assembly as claimed in claim 5, wherein said transducer means comprise a capacitor.

8. An assembly as claimed in claim 5, wherein said transducer is an electrohydrodynamic transducer.

9. An assembly as claimed in claim 5, wherein said transducer is a sonic or ultrasonic transducer.

10. An assembly as claimed in claim 5, wherein said transducer is a piezo electric transducer.

11. An assembly as claimed in claim 1, comprising a laser impacting said location, and a shutter cutting off the beam of said laser at said frequency.

12. An assembly as claimed in claim 1, comprising a reservoir containing said vapor of said liquid and port means alternatively cutting off and communicating with said microchannel at said frequency.

13. An assembly as claimed in claims 1, wherein said location is located in the flow path within said microchannel.

14. An assembly as claimed in claim 1, wherein said location is a nucleation chamber in fluid communication with the flow in said microchannel.

15. An assembly as claimed in claim 14, wherein said nucleation chamber is located at the wall of said microchannel.

16. An assembly as claimed in claim 15, comprising at least one temperature sensor sensing a temperature of a wall of said evaporator device, and in that the frequency of said bubble generator is adjustable in function of said sensed temperature.

17. A process for cooling a heat generating electronic device by means of a cooling liquid, implementing a heat transfer assembly as claimed in claim 1.

18. A process as claimed in claim 17, wherein said cooling liquid is set in a saturated condition at the inlet of said bubble generator.

19. A process as claimed in claim 18, wherein said frequency of bubble generation is continuously adjusted in function of a temperature measurement.