Method of processing end portions of optical fibers and optical fibers having their end portions processed

• US 7,261,827 B2
• Filed: 04/02/2004
• Issued: 08/28/2007
• Est. Priority Date: 12/27/2000
• Status: Expired due to Fees

• Current Assignee: Japan Aviation Electronics Industry Limited
• Original Assignee: Japan Aviation Electronics Industry Limited
• Inventors: Tai, Tomishige, Murakami, Keiji, Ootsu, Kenji
• Primary Examiner(s): Norton; Nadine G.
• Assistant Examiner(s): Tran; Binh X.
• Application Number:
  US10/816,622
• Publication Number:
  US 20040228591A1
• Time in Patent Office: 1,243 Days
• Field of Search: 216/7, 216/11, 216/24, 216/96
• US Class Current: 216/7
• CPC Class Codes: C03C 25/68 by etching
• CPC Class Codes: G02B 6/245 Removing protective coverings of light guides before coupling
• CPC Class Codes: G02B 6/262 Optical details of coupling light into, or out of, or between fibre ends, e.g. special fibre end shapes or associated optical elements

Abstract

An end portion of an optical fiber element 11 is dipped into an etchant to shape that portion of the fiber element immersed in said etchant into a coaxial reduced-diameter portion by etching while causing that portion of the fiber element where the etchant rising to a certain height above the level surface of the etchant due to surface tension into a conical tapered surface portion which is formed between the reduced-diameter portion and un-etched portion of the fiber element, and subsequently thereafter, the reduced-diameter portion is cut to have a very short length thereof remained.

Claims

1. A method for processing an end portion of an optical fiber element having a center core in the axial center thereof, a cylindrical clad surrounding said core and an outer cover coating film surrounding said clad, comprising the steps of:

removing said coating film in a partial cylindrical portion thereof having a specified length so as to form a coating film-removed section and a residual coating film section at one end portion of said optical fiber element;

dipping a first part of said coating film-removed section and whole part of said residual coating film section disposed at said one end portion of said optical fiber element into an etchant capable of etching materials of said core and clad of said fiber element perpendicularly to level surface of said etchant in such a manner that a remaining second part of said coating film-removed section is extending upwardly from the level surface of said etchant to thereby initiate etching process;

causing such a portion of the clad as exposed at the first part of the coating film-removed section of said fiber element and immersed in said etchant to be etched into a coaxial reduced-diameter portion while causing such a portion of the clad as exposed at the second part of the coating film-removed section and attached thereto with said etchant which rises to a certain height above said level surface due to surface tension of the etchant to be etched into a conical tapered surface portion which is formed between the reduced-diameter portion and un-etched portion of said fiber element;

terminating the etching once said reduced-diameter portion reaches a certain diameter that is close to but larger than the diameter of the center core; and

cutting said reduced-diameter portion at a point spaced by a distance which does not exceed the diameter of the reduced-diameter portion from the boundary between said tapered surface portion and said reduced-diameter portion toward the reduced-diameter portion so as to leave a reduced-diameter end portion continuously joining said tapered surface portion.

2. The method according to claim 1, wherein a plurality of said optical fiber elements held in parallel to each other by a single common covering member to thereby form an optical fiber array, are subjected to processing.

3. The method according to claim 1, wherein said distance is one of:

(1) 20-30 μ

m,

(2) 40-60% of the diameter of the core or

(3) 16-24% of the diameter of the optical fiber element.

4. The method according to claim 1, wherein a liquid having a specific gravity lower than that of said etchant is mixed into said etchant.

5. The method according to claim 4, wherein a plurality of said optical fiber elements held in parallel to each other by a single common covering member to thereby form an optical fiber array, are subjected to processing.

6. The method according to claim 1, which further comprises a step of providing, before the dipping step, a level controlling means for restraining the level surface of said etchant to said optical fiber element at a position where said optical fiber element contacts the level surface of said etchant whereby the axial dimension of said tapered surface portion to be formed on said optical fiber element is set at a predetermined value.

7. The method according to claim 6 wherein, said level controlling means is constituted by an etching-resistant film formed around the peripheral surface of said optical fiber element.

8. The method according to claim 6, wherein a plurality of said optical fiber elements held in parallel to each other by a single common covering member to thereby form an optical fiber array, are subjected to processing.

9. The method according to claim 6, wherein a liquid having a specific gravity lower than that of said etchant is mixed into said etchant.

10. The method according to claim 9, wherein a plurality of said optical fiber elements held in parallel to each other by a single common covering member to thereby form an optical fiber array, are subjected to processing.

11. The method according to claim 6 wherein, said level controlling means is constituted by a coating film applied to said optical fiber element.

12. The method according to claim 11, wherein a plurality of said optical fiber elements held in parallel to each other by a single common covering member to thereby form an optical fiber array, are subjected to processing.

13. The method according to claim 11, wherein a liquid having a specific gravity lower than that of said etchant is mixed into said etchant.

14. The method according to claim 13, wherein a plurality of said optical fiber elements held in parallel to each other by a single common covering member to thereby form an optical fiber array, are subjected to processing.

15. The method according to claim 6 wherein, said level controlling means comprises a flat plate made of etching-resistant material and through-apertures formed through said flat plate perpendicularly to the plane of the flat plate, each of said through-apertures having a diameter slightly larger than the outer diameter of the corresponding optical fiber element.

16. The method according to claim 15, wherein a plurality of said optical fiber elements held in parallel to each other by a single common covering member to thereby form an optical fiber array, are subjected to processing.

17. The method according to claim 15, wherein a liquid having a specific gravity lower than that of said etchant is mixed into said etchant.

18. The method according to claim 17, wherein a plurality of said optical fiber elements held in parallel to each other by a single common covering member to thereby form an optical fiber array, are subjected to processing.

19. A method for processing an end portion of an optical fiber element having a center core and an outer clad surrounding said core, comprising the steps of:

providing, a level controlling means for restraining a level surface of an etchant to said optical fiber element at a position where said optical fiber element contacts the level surface of said etchant;

dipping one end portion of said optical fiber element into an etchant capable of etching the fiber element perpendicularly to level surface of said etchant so that said level controlling means contacts at one end thereof to the level surface of said etchant;

causing the outer clad of said one end portion of said fiber element immersed in said etchant to be etched into a substantially coaxial reduced-diameter portion while causing the outer clad of such a portion of said fiber element that is extended upwardly to a certain height from the level controlling means and that is attached with the etchant which rises upwardly from the level controlling means due to surface tension of the etchant to be etched into a conical tapered surface portion which is formed between the reduced-diameter portion and un-etched portion of said fiber element whereby the axial dimension of said tapered surface portion to be formed on said optical fiber element is set at a predetermined value;

terminating the etching once said reduced-diameter portion reaches a certain diameter that is close to but larger than the diameter of the center core; and

cutting said reduced-diameter portion at a point spaced by a distance which does not exceed the diameter of the reduced-diameter portion from the boundary between said tapered surface portion and said reduced-diameter portion toward the reduced-diameter portion so as to leave a reduced-diameter end portion continuously joining said tapered surface portion.

20. The method according to claim 19, wherein a plurality of said optical fiber elements held in parallel to each other by a single common covering member to thereby form an optical fiber array, are subjected to processing.

21. The method according to claim 19, wherein a liquid having a specific gravity lower than that of said etchant is mixed into said etchant.

22. The method according to claim 21, wherein a plurality of said optical fiber elements held in parallel to each other by a single common covering member to thereby form an optical fiber array, are subjected to processing.

23. The method according to claim 19 wherein, said level controlling means is constituted by an etching-resistant film formed around the peripheral surface of said optical fiber element.

24. The method according to claim 23, wherein a plurality of said optical fiber elements held in parallel to each other by a single common covering member to thereby form an optical fiber array, are subjected to processing.

25. The method according to claim 23, wherein a liquid having a specific gravity lower than that of said etchant is mixed into said etchant.

26. The method according to claim 25, wherein a plurality of said optical fiber elements held in parallel to each other by a single common covering member to thereby form an optical fiber array, are subjected to processing.

27. The method according to claim 19 wherein, said level controlling means is constituted by a coating film applied to said optical fiber element.

28. The method according to claim 27, wherein a plurality of said optical fiber elements held in parallel to each other by a single common covering member to thereby form an optical fiber array, are subjected to processing.

29. The method according to claim 27, wherein a liquid having a specific gravity lower than that of said etchant is mixed into said etchant.

30. The method according to claim 29, wherein a plurality of said optical fiber elements held in parallel to each other by a single common covering member to thereby form an optical fiber array, are subjected to processing.

31. The method according to claim 19 wherein, said level controlling means comprises a flat plate made of etching-resistant material and through-apertures formed through said flat plate perpendicularly to the plane of the flat plate, each of said through-apertures having a diameter slightly larger than the outer diameter of the corresponding optical fiber element.

32. The method according to claim 31, wherein a plurality of said optical fiber elements held in parallel to each other by a single common covering member to thereby form an optical fiber array, are subjected to processing.

33. The method according to claim 31, wherein a liquid having a specific gravity lower than that of said etchant is mixed into said etchant.

34. The method according to claim 33, wherein a plurality of said optical fiber elements held in parallel to each other by a single common covering member to thereby form an optical fiber array, are subjected to processing.