Process for forming a patterned thin film structure on a substrate

• US 7,261,920 B2
• Filed: 09/19/2003
• Issued: 08/28/2007
• Est. Priority Date: 04/24/2002
• Status: Active Grant

• Current Assignee: E Ink California, LLC (E Ink Holdings Incorporated)
• Original Assignee: SiPix Imaging, Inc. (E Ink Holdings Incorporated)
• Inventors: Wu, Zarng-Arh George, Liang, Rong-Chang, Chaug, Yi-Shung, Haubrich, Jeanne E.
• Primary Examiner(s): Fiorilla; Chris
• Assistant Examiner(s): Chan; Sing P.
• Application Number:
  US10/666,912
• Publication Number:
  US 20040131779A1
• Time in Patent Office: 1,439 Days
• Field of Search: 156/344, 156/247, 156/277, 156/278, 156/584, 427154-156, 427272-274, 427/282, 427/248.1, 427/259, 427/258, 427/261, 427/265, 101/114, 101/128.21, 101/129, 118/504, 438/478, 438/479, 438/759, 438/763
• US Class Current: 427/259
• CPC Class Codes: G02F 1/13439 characterised by their electrical, optical, physical properties; materials therefor; method of making
• CPC Class Codes: H05K 2201/0317 Thin film conductor layer; Thin film passive component
• CPC Class Codes: H05K 2203/0257 Brushing, e.g. cleaning the conductive pattern by brushing or wiping
• CPC Class Codes: H05K 2203/0264 Peeling insulating layer, e.g. foil, or separating mask
• CPC Class Codes: H05K 2203/0522 Using an adhesive pattern
• CPC Class Codes: H05K 2203/0746 Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
• CPC Class Codes: H05K 3/04 the conductive material being removed mechanically, e.g. by punching
• CPC Class Codes: H05K 3/048 using a lift-off resist pattern or a release layer pattern
• CPC Class Codes: H05K 3/146 By vapour deposition
• CPC Class Codes: H05K 3/16 by cathodic sputtering
• CPC Class Codes: H05K 3/184 using masks
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: Y10S 156/922 Specified electronic component delaminating in preparation for recycling
• CPC Class Codes: Y10T 156/11 Methods of delaminating, per se; i.e. , separating at bonding face

Abstract

A process for forming a patterned thin film structure on a substrate is disclosed. A pattern is printed with a material, such as a masking coating or an ink, on the substrate, the pattern being such that, in one embodiment, the desired thin film structures will be formed in the areas where the printed material is not present, i.e., a negative image of thin film structure to be formed is printed. In another embodiment, the pattern is printed with a material that is difficult to strip from the substrate, and the desired thin film structures will be formed in the areas where the printed material is present, i.e., a positive image of the thin film structure is printed. The thin film material is deposited on the patterned substrate, and the undesired area is stripped, leaving behind the patterned thin film structures.

Claims

1. A process for forming a thin film structure on a substrate, comprising:

printing on the substrate with a first material a pattern that defines a positive image of the thin film structure such that the first material is printed in the area where the thin film structure is to be formed, the first material being strippable using a first solvent;

overcoating the printed surface of the substrate with a second material that is not strippable using the first solvent;

stripping the first material away using the first solvent in a process that strips away the first material and the second material formed on the first material without stripping away the second material formed directly on the substrate, such that the second material remains coated on the substrate where the first material was not present, thereby defining a negative image of the thin film structure such that the second material is not present in the area where the thin film structure is to be formed;

depositing a thin film material on the patterned surface of the substrate; and

stripping the second material and the thin film material deposited on the second material to form the thin film structure.

2. The process for forming a thin film structure on a substrate as recited in claim 1, wherein the first material repels the second material that the second material fills in the areas of the substrate where the first material has not been printed without coating the areas where the first material is present.

3. The process for forming a thin film structure on a substrate as recited in claim 1, wherein the first solvent is an aqueous solution or water.

4. The process for forming a thin film structure on a substrate as recited in claim 1, wherein the first solvent is a non-aqueous solvent or solution.

5. The process for forming a thin film structure on a substrate as recited in claim 1, wherein the first solvent is an aqueous basic solution, and the step of stripping the second material comprises using a second solvent comprising an aqueous acidic solution, an aqueous neutral solution, or water.

6. The process for forming a thin film structure on a substrate as recited in claim 1, wherein the first solvent is an aqueous acidic solution and the step of stripping the second material comprises using a second solvent comprising an aqueous basic solution, an aqueous neutral solution, or water.

7. The process for forming a thin film structure on a substrate as recited in claim 1, wherein the first solvent is an aqueous neutral solution or water and the step of stripping the second material comprises using a second solvent comprising an aqueous acidic solution or an aqueous basic solution.