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Hot melt adhesive composition based on a random copolymer of isotactic polypropylene and a secondary polymer

  • US 7,262,251 B2
  • Filed: 10/27/2003
  • Issued: 08/28/2007
  • Est. Priority Date: 10/28/2002
  • Status: Expired due to Term
First Claim
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1. A hot melt adhesive composition comprising a blend of the following components:

  • (a) about 4% to 50% by weight of a random RCP copolymer of propylene and at least one α

    -olefin comonomer having the following molecular structure;


    R—

    CH═

    CH2where R is hydrogen or a C2 to C10 alkyl group, and said α

    -olefin comprises about 1.5% by weight to about 20% by weight of the said RCP copolymer wherein said RCP copolymer has a density of about 0.88 g/cc to 0.905 g/cc and a melt flow rate of about 5 g/10 min to about 200 g/10 min and a melting point equal to or less than 145°

    C.;

    (b) about 20% to 65% by weight of a tackifier;

    (c) about 5% to 60% by weight of an atactic poly-α

    -olefin (APAO) polymer;

    (d) about 0% to 40% by weight of a plasticizer;

    (e) about 0% to 40% by weight of a wax;

    (f) about 0% to 3% by weight of a stabilizer;

    (g) about 0% to 60% by weight of a filler; and

    (h) about 2% to 40% by weight of a secondary polymer in addition to said RCP copolymer, said APAO polymer and said tackifier;

    the components totaling 100% by weight of the composition.

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