III-nitride semiconductor light emitting device having a silver p-contact

• US 7,262,436 B2
• Filed: 04/11/2005
• Issued: 08/28/2007
• Est. Priority Date: 12/15/1997
• Status: Expired due to Term

• Current Assignee: Lumileds LLC (Apollo Global Management, Inc.)
• Original Assignee: Philips Lumileds Lighting Company LLC (Apollo Global Management, Inc.)
• Inventors: Watanabe, Satoshi, Kondoh, You, Kaneko, Yawara, Nakagawa, Shigeru, Yamada, Norihide
• Primary Examiner(s): Louie; Wai-Sing
• Assistant Examiner(s): Hafiz; Mursalin B.
• Application Number:
  US11/104,310
• Publication Number:
  US 20050179051A1
• Time in Patent Office: 869 Days
• Field of Search: 257/676, 257/368, 257/81, 257/94, 257/99, 368/83, 362/612, 399/4, 235/462, 438/23, 438/FOR.15
• US Class Current: 257/94
• CPC Class Codes: H01L 2224/4847 the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
• CPC Class Codes: H01L 33/40 Materials therefor
• CPC Class Codes: H01L 33/42 Transparent materials

Abstract

A light emitting device includes an n-type semiconductor layer, an active layer for generating light, the active layer being in electrical contact with the n-type semiconductor layer. A p-type semiconductor layer is in electrical contact with the active layer, and a p-electrode is in electrical contact with the p-type semiconductor layer. The p-electrode includes a layer of silver. In a preferred embodiment of the present invention, the n-type semiconductor layer and the p-type semiconductor layer are constructed from group III nitride semiconducting materials. In one embodiment of the invention, the silver layer is sufficiently thin to be transparent. In other embodiments, the silver layer is thick enough to reflect most of the light incident thereon. A fixation layer may be provided. The fixation layer may be a dielectric or a conductor.

Claims

1. A structure comprising:

a semiconductor light emitting device comprising an n-type region, a p-type region, and an active region disposed between n-type region and the p-type region, the active region being configured to emit light; and

a reflective p-electrode overlying and electrically connected to the p-type region, the p-electrode comprising;

a first layer comprising silver;

a second layer comprising nickel; and

a third layer comprising a metal, wherein the first layer and the second layer are disposed between the p-type region and the third layer.

2. The structure of claim 1 wherein the first layer is reflective of light emitted by the active region.

3. The structure of claim 1 wherein the semiconductor light emitting device comprises a plurality of III-nitride layers.

4. The structure of claim 1 wherein the first layer has a thickness of at least 100 nm.

5. The structure of claim 1 wherein the second layer has a lateral extent at least as large as the first layer.

6. The structure of claim 1 wherein the first layer is disposed between the p-type region and the second layer.

7. The structure of claim 1 wherein the third layer has a lateral extent at least as large as the first layer.

8. The structure of claim 1 wherein the third layer comprises gold.

9. A structure comprising:

a semiconductor light emitting device comprising an n-type region, a p-type region, and an active region disposed between n-type region and the p-type region, the active region being configured to emit light; and

a p-electrode overlying and electrically connected to the p-type region, the p-electrode comprising;

a first layer comprising silver;

a second layer comprising nickel; and

a third layer comprising titanium, wherein the third layer is a dielectric.

10. The structure of claim 9 further comprising at least one opening formed in the third layer.

11. The structure of claim 10 further comprising a bonding pad disposed in the opening.