Nonvolatile semiconductor memory device and nonvolatile semiconductor memory system

• US 7,262,455 B2
• Filed: 04/14/2004
• Issued: 08/28/2007
• Est. Priority Date: 09/29/2000
• Status: Expired due to Fees

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Sukegawa, Hiroshi, Tanaka, Tomoharu
• Primary Examiner(s): NGUYEN, CUONG QUANG
• Application Number:
  US10/823,568
• Publication Number:
  US 20040195617A1
• Time in Patent Office: 1,231 Days
• Field of Search: 711/103, 257314-324, 257678-681
• US Class Current: 257/315
• CPC Class Codes: G11C 16/0483 comprising cells having several storage transistors connected in series
• CPC Class Codes: G11C 16/08 Address circuits; Decoders; Word-line control circuits
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48464 the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H10B 69/00 Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices

Abstract

A nonvolatile semiconductor memory package includes a memory device having a memory cell array including a plurality of nonvolatile semiconductor memory cells, a control portion configured to control the memory device, a network interface connectable to a network, a file management portion connected to the network interface configured to manage a relationship between a data file given from the network and an address of the memory cell array, and a memory interface connected to the file management portion configured to convert a signal given from the network to a signal that is capable of being used at the control portion. The package is wrapped by an insulating material.

Claims

1. A nonvolatile semiconductor memory package comprising:

a memory device having a memory cell array including a plurality of nonvolatile semiconductor memory cells;

a control portion configured to control the memory device;

a network interface connectable to a network;

a file management portion connected to the network interface and configured to independently manage a relationship between a data file from the network and an address of the memory cell array; and

a memory interface connected to the file management portion and configured to convert a signal from the file management portion to a signal which is capable of being used at the control portion.

2. The nonvolatile semiconductor memory package according to claim 1, wherein the network interface corresponds to a transmission control protocol/internet protocol.

3. The nonvolatile semiconductor memory package according to claim 2, wherein the network interface is connectable to the network by using a file transfer protocol.

4. The nonvolatile semiconductor memory package according to claim 2, wherein the network interface is connectable to the network by using an anonymous file transfer protocol.

5. The nonvolatile semiconductor memory package according to claim 2, wherein the network interface is connectable to the network by using a point-to-point protocol.

6. The nonvolatile semiconductor memory package according to claim 1, wherein the package is also connectable to equipment disconnected from the network.

7. The nonvolatile semiconductor memory package according to claim 6, wherein the package functions as a storage device for the equipment.

15. The nonvolatile semiconductor memory package according to claim 1, wherein the memory cell array includes a NAND type memory cell unit.

17. The nonvolatile semiconductor memory package according to claim 1, further comprising a power source unit.

19. The nonvolatile semiconductor memory package according to claim 1, wherein the nonvolatile semiconductor memory package is connectable to a download machine to hold software from a data server linked with the download machine via the network.

8. A detachable memory device comprising:

a memory device having a memory cell array including a plurality of nonvolatile semiconductor memory cells;

a control portion configured to control the memory device;

a network interface connectable to a network;

a file management portion connected to the network interface and configured to independently manage a relationship between a data file from the network and an address of the memory cell array; and

a memory interface connected to the file management portion and configured to convert a signal from the file management portion to a signal which is capable of being used at the control portion.

9. The detachable memory device according to claim 8, wherein the network interface corresponds to a transmission control protocol/internet protocol.

10. The detachable memory device according to claim 8, wherein the network interface is connectable to the network by using a file transfer protocol.

11. The detachable memory device according to claim 8, wherein the network interface is connectable to the network by using an anonymous file transfer protocol.

12. The detachable memory device according to claim 8, wherein the network interface is connectable to the network by using a point-to-point protocol.

13. The detachable memory device according to claim 8, wherein the detachable memory device is also connectable to equipment disconnected from the network.

14. The detachable memory device according to claim 13, wherein the detachable memory device functions as a storage device for the equipment.

16. The detachable memory device according to claim 8, wherein the memory cell array includes a NAND type memory cell unit.

18. The detachable memory device according to claim 8, further comprising a power source unit.

20. The detachable memory device according to claim 8, wherein the detachable memory device is connectable to a download machine to hold software from a data server linked with the download machine via the network.