Assembly with a ring and bonding pads formed of a same material on a substrate
First Claim
Patent Images
1. An assembly, comprising:
- a substrate;
a device coupled to said substrate;
a ring formed on said substrate around said device and extending from said substrate higher than said device such that a cover can be sealed to said ring over said device; and
one or more bonding pads formed on said substrate exterior to and separate from said ring, said bonding pad being formed of a conductive material and configured for making an electrical connection between said device and an external circuit,wherein said ring and bonding pads are formed of a same material.
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Abstract
An assembly includes a substrate, a device coupled to the substrate; a ring formed on the substrate; and one or more bonding pads formed on the substrate, wherein the ring and bonding pads are formed of a same material.
23 Citations
20 Claims
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1. An assembly, comprising:
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a substrate; a device coupled to said substrate; a ring formed on said substrate around said device and extending from said substrate higher than said device such that a cover can be sealed to said ring over said device; and one or more bonding pads formed on said substrate exterior to and separate from said ring, said bonding pad being formed of a conductive material and configured for making an electrical connection between said device and an external circuit, wherein said ring and bonding pads are formed of a same material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 13, 14, 15, 16, 17, 19, 20)
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9. An electronic device, comprising:
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an substrate having a device supported thereon; a ring also disposed on said substrate, wherein said ring surrounds said device such that a cover can be sealed to said ring over said device; bonding pads formed on said substrate exterior to and separate from said ring, said bonding pad being formed of a conductive material and electrically connected to said device, said bonding pads and ring being formed of substantially the same material; a circuit having circuit leads electrically coupled to said bonding pads; and a controller coupled to said circuit. - View Dependent Claims (10, 11, 12, 18)
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Specification