Gyro-sensor comprising a plurality of component units, and fabricating method thereof

• US 7,263,883 B2
• Filed: 06/01/2005
• Issued: 09/04/2007
• Est. Priority Date: 06/01/2004
• Status: Expired due to Fees

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Lee, Moon-chul, Moon, Chang-youl, Park, Tae-sik
• Primary Examiner(s): KWOK, HELEN C
• Application Number:
  US11/141,054
• Publication Number:
  US 20050262941A1
• Time in Patent Office: 825 Days
• Field of Search: 734/93, 735/041.2, 257414-417, 257/120, 257/127, 257674-698, 257774-778
• US Class Current: 73/493
• CPC Class Codes: B81B 2207/07 Interconnects
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: G01C 19/56 Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation

Abstract

Provided are a gyro-sensor including a plurality of component units and a method of fabricating the gyro-sensor. The gyro-sensor includes: a substrate; a micro electro mechanical system structure including a surface including a predetermined area in which a cavity is formed and connected to an upper surface of the substrate to output a vibration signal proportional to an external rotation force; and a circuit unit positioned in the cavity, converting the vibration signal into a predetermined electric signal proportional to a circular angular velocity, and outputting the predetermined electric signal.

Claims

1. A gyro-sensor comprising:

a substrate;

a micro electro mechanical system structure comprising a surface comprising a predetermined area in which a cavity is formed and connected to an upper surface of the substrate to output a vibration signal proportional to an external rotation force; and

a circuit unit positioned in the cavity, converting the vibration signal into a predetermined electric signal proportional to a circular angular velocity, and outputting the predetermined electric signal.

2. The gyro-sensor of claim 1, wherein the micro electro mechanical system structure is connected to time upper surface of the substrate so that the surface in which the cavity is formed faces the substrate.

3. The gyro-sensor of claim 2, further comprising:

connectors electrically connecting the micro electro mechanical system structure and the circuit unit to the substrate.

4. The gyro-sensor of claim 1, wherein the micro electro mechanical system structure is connected to the upper surface of the substrate so that the surface in which the cavity is formed faces a direction opposite to the substrate.

5. The gyro-sensor of claim 4, further comprising:

connectors electrically connecting the circuit unit to the cavity formed in the micro electro mechanical system structure.

6. The gyro-sensor of claim 1, wherein the circuit unit comprises:

an analog application specific integrated circuit converting the vibration signal into a predetermined analog signal proportional to the circular angular velocity; and

a digital application specific integrated circuit converting the predetermined analog signal into a digital signal.

7. The gyro-sensor of claim 1, wherein the micro electro mechanical system structure comprises;

a lower class substrate comprising a surface comprising a predetermined area in which the cavity is formed;

a silicon layer connected to a surface opposite to the surface of the lower glass substrate in which the cavity is formed and patterned in a predetermined vibration structure shape;

a conductive layer formed on the lower glass substrate to be connected to the silicon layer; and

an upper glass substrate connected to the silicon layer in an opposite direction to a direction along which the lower glass substrate is connected to the silicon layer.

9. The gyro-sensor of claim 1, wherein the cavity is disposed directly opposite to said substrate.

8. A single chip comprising:

a first element composing a surface comprising a predetermined area in which a cavity is formed, wherein the first element outputs a vibration signal proportional to an external rotation force;

a second element positioned in the cavity of the first element, wherein the second element converts said vibration signal into a predetermined electric signal proportional to a circular angular velocity; and

a substrate connected to the first and second elements via conductive materials to support the first and second elements.