Method and apparatus for cleaning a substrate using megasonic power

• US 7,264,007 B2
• Filed: 06/30/2003
• Issued: 09/04/2007
• Est. Priority Date: 09/30/2002
• Status: Expired due to Fees

• Current Assignee: Lam Research Corporation
• Original Assignee: Lam Research Corporation
• Inventors: Ravkin, Mike, Redeker, Fred C., Boyd, John M., de Larios, John
• Primary Examiner(s): Perrin; Joseph L.
• Application Number:
  US10/611,140
• Publication Number:
  US 20040069319A1
• Time in Patent Office: 1,527 Days
• Field of Search: 134/1.3, 134/26, 134/34, 134/36, 134/95.2, 134/99.1, 134/102.3, 134/184, 134/901, 134/902
• US Class Current: 134/95.2
• CPC Class Codes: C25D 17/001 Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
• CPC Class Codes: C25D 5/34 Pretreatment of metallic surfaces to be electroplated
• CPC Class Codes: H01L 21/02041 Cleaning
• CPC Class Codes: H01L 21/02052 Wet cleaning only H01L21/02085 takes precedence
• CPC Class Codes: H01L 21/67028 for cleaning followed by drying, rinsing, stripping, blasting or the like
• CPC Class Codes: H01L 21/67034 for drying
• CPC Class Codes: H01L 21/67046 using mainly scrubbing means, e.g. brushes
• CPC Class Codes: H01L 21/67051 using mainly spraying means, e.g. nozzles
• CPC Class Codes: Y10S 134/902 Semiconductor wafer

Abstract

A method for processing a substrate is provided that includes generating a fluid meniscus on a surface of the substrate and applying acoustic energy to the fluid meniscus. The method also includes moving the fluid meniscus over the surface the substrate to process the surface of the substrate.

Claims

1. A head having a head surface, the head used in a substrate preparation apparatus, the head configured to be disposed proximate to a surface of a substrate, comprising:

at least one of a first source inlet for delivering a first fluid to the surface of the substrate through the head;

at least one of a second source inlet for delivering a second fluid to the surface of the substrate through the head, the second fluid being different than the first fluid;

at least one of a source outlet for removing each of the first fluid and the second fluid from the surface of the substrate, at least a portion of the at least one of the source outlet being located in between the at least one of the first source inlet and the at least one of the second source inlet; and

a transducer disposed in the head for applying acoustic energy at a location between the at least one of a first source inlet and the source outlet;

wherein the head surface has substantially flat surface regions, and the head surface is defined so that the at least one of the first source inlet, the second source inlet and the source outlet are defined by discrete holes that reside at the head surface and extend through the substantially flat surface regions of the head surface.

2. The head as recited in claim 1, wherein the first fluid is a cleaning chemistry.

3. The head as recited in claim 1, wherein the transducer includes a body and a piezoelectric crystal defined in the body.

4. The head as recited in claim 3, wherein the transducer is attached to an RF supply and the piezoelectric crystal within the transducer is capable of receiving RF and generating the acoustic energy.

5. The head as recited in claim 1, wherein the acoustic energy is at least one of an ultrasonic waves and megasonic waves.

6. The head as recited in claim 1, wherein the transducer is configured to apply megasonic waves to a fluid meniscus defined by the first or second fluid.

7. The head of claim 1, wherein the at least one of the second source inlet surrounds at least a trailing edge side of the at least one of the source outlet.

8. A head having a head surface, the head used in a substrate preparation apparatus, the head configured to be disposed proximate to a surface of a substrate, comprising:

a plurality of first source inlets for delivering a first fluid to the surface of the substrate through the head;

a plurality of second source inlets for delivering a second fluid to the surface of the substrate through the head;

a plurality of source outlets for at least partially removing each of the first fluid and the second fluid from the surface of the substrate to define a meniscus, and at least a portion of the plurality of source outlets being aligned in between the plurality of first source inlets and the plurality of second source inlets; and

a transducer disposed in the head at a position that is adjacent to the head surface, the transducer defined to apply acoustic energy in a region of the head surface that is between the plurality of first source inlets and the plurality of source outlets;

wherein the head surface has substantially flat surface regions, and the head surface is defined so that the first source inlets, the second source inlets and the source outlets are defined by discrete holes that reside at the head surface and extend through the substantially flat surface regions of the head surface.

9. The head of claim 8, wherein the transducer includes a body and a piezoelectric crystal defined in the body.

10. The head of claim 9, wherein the transducer is attached to an RF supply and the piezoelectric crystal within the transducer is coupled to RF power to define acoustic energy.

11. The head of claim 9, wherein the acoustic energy is one of an ultrasonic waves or megasonic waves.

12. The head of claim 8, wherein the transducer is configured to apply megasonic waves to a fluid meniscus.