Removable flash integrated memory module card and method of manufacture

• US 7,264,992 B2
• Filed: 08/06/2004
• Issued: 09/04/2007
• Est. Priority Date: 08/06/2004
• Status: Expired due to Fees

• Current Assignee: Super Talent Electronics, Inc.
• Original Assignee: Super Talent Electronics, Inc.
• Inventors: Hsueh, Paul, Ni, Jim, Wang, Kuang-Yu, See, Sun-Teck
• Primary Examiner(s): THAI, LUAN C
• Application Number:
  US10/913,868
• Publication Number:
  US 20060030080A1
• Time in Patent Office: 1,124 Days
• Field of Search: 438/106, 438125-126, 257679-680, 257/E23.064
• US Class Current: 438/106
• CPC Class Codes: G11C 2029/4402 Internal storage of test result, quality data, chip identification, repair information
• CPC Class Codes: G11C 5/04 Supports for storage elements , e.g. memory modules; Mounting or fixing of storage elements on such supports
• CPC Class Codes: H01L 23/5388 for flat cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/117 Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2201/0909 Preformed cutting or breaking line
• CPC Class Codes: H05K 2201/10053 Switch
• CPC Class Codes: H05K 2201/10446 Mounted on an edge soldering edge mounted components H05K3/3405; edge terminals H05K2201/1034
• CPC Class Codes: H05K 2203/1316 Moulded encapsulation of mounted components
• CPC Class Codes: H05K 3/0052 Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence

Abstract

A removable Flash integrated memory module card has a plastic shell and an integral Flash memory module. On the backside of the card, there are exposed contact pads. When the card is inserted into a card-hosting device, the card can communicate with the device through the exposed pads. The manufacturing method includes manufacturing of the memory module and utilizing plastic molding techniques for making the card outer body. The method involves preparing the substrate, mounting the components, testing the module, preparing the molding device, and molding the card body.

Claims

1. A method for fabricating a semiconductor card, said method comprising the steps of:

preparing a substrate;

mounting electrical components to the substrate to form a module by providing the substrate with soldering pads, providing a switch base with soldering legs, and soldering the switch base legs to the substrate soldering pads;

preparing a molding device; and

molding the card body over the substrate and electrical components.

2. The method for fabricating a semiconductor card of claim 1 further including the step of testing the electrical components before the step of molding the card body.

3. The method for fabricating a semiconductor card of claim 1 wherein the step of preparing the substrate includes preparing a plurality of individual card size substrates.

4. The method for fabricating a semiconductor card of claim 1 wherein the step of preparing the substrate includes preparing a plurality of individual card size substrates connected to carrier strips.

5. The method for fabricating a semiconductor card of claim 4 wherein the step of preparing the substrate includes making the substrate and carrier strips from the same material.

6. The method for fabricating a semiconductor card of claim 4 wherein the step of preparing the substrate includes providing a cutout between neighboring card substrates.

7. The method for fabricating a semiconductor card of claim 4 wherein the step of preparing the substrate includes providing markings on the carrier to facilitate registration.

8. The method for fabricating a semiconductor card of claim 4 wherein the step of preparing the substrate includes providing holes on the carrier to facilitate registration.

9. The method for fabricating a semiconductor card of claim 1 wherein the step of preparing the molding device includes providing colunms corresponding to the semiconductor card contact pad locations, so that when the module is inserted inside the mold the columns coincide with metal pads and cover the metal pads and prevent them from being covered by plastic.

10. The method for fabricating a semiconductor card of claim 9 wherein the step of preparing the molding device includes providing holes in the columns for connection to a vacuum, so that the vacuum pulls the pads against the columns, further preventing melted plastic from covering the pads.

11. The method for fabricating a semiconductor card of claim 1 wherein the step of preparing the substrate includes providing a substrate having a shape generally similar to the card shape but smaller to permit encapsulation during the molding process.

12. The method for fabricating a semiconductor card of claim 1 wherein the step of preparing the substrate includes providing slots between the contact pads so that ribs are formed between the pads during the molding process.

13. The method for fabricating a semiconductor card of claim 1 wherein the step of preparing the molding device before the step of molding the card body includes applying a release film.

14. The method for fabricating a semiconductor card of claim 1 including the step of installing a switch on the switch base.

15. The method for fabricating a semiconductor card of claim 1 wherein the step of installing a switch on the switch base comprises installing an insert into a slot on the switch base.

16. The method for fabricating a semiconductor card of claim 1 wherein the insert is made of a resilient material and is larger than the slot on the switch base, to effect a tight fit.

17. The method for fabricating a semiconductor card of claim 1 wherein the switch is electrically connected to the substrate circuitry.

18. The method for fabricating a semiconductor card of claim 1 wherein the switch has at least two positions.