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Semiconductor device including inclined cut surface and manufacturing method thereof

  • US 7,264,997 B2
  • Filed: 07/16/2004
  • Issued: 09/04/2007
  • Est. Priority Date: 07/16/2003
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • an electrically-insulating sealed body forming a mounting surface, a first side surface substantially perpendicular to the mounting surface, a second side surface substantially perpendicular to the first side surface and the mounting surface, a first inclined cut surface disposed between the mounting surface and the first side surface, and a second inclined cut surface disposed between the mounting surface and the second side surface;

    a semiconductor element disposed within said sealed body; and

    first through fourth electrodes disposed within said sealed body and electrically connected to the semiconductor element, the first and second electrodes each being exposed on the mounting surface and the first inclined cut surface, and the third and fourth electrodes each being exposed on the mounting surface and the second inclined cut surface,wherein the first and second inclined cut surfaces are linearly or curvedly inclined cut surfaces.

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