Method of joining terminals by soldering

• US 7,265,315 B2
• Filed: 10/14/2004
• Issued: 09/04/2007
• Est. Priority Date: 06/10/2004
• Status: Expired due to Fees

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Nishitani, Shoichiro, Yamada, Takahiro, Oohashi, Atsushi
• Primary Examiner(s): Heinrich; Samuel M.
• Application Number:
  US10/963,570
• Publication Number:
  US 20050274704A1
• Time in Patent Office: 1,055 Days
• Field of Search: 219/121.64, 219/121.66, 219/121.82, 219/85.13, 219/85.18, 219/121.65, 219/121.85, 219/121.86, 228/179.1, 228/222, 228/232
• US Class Current: 219/121.66
• CPC Class Codes: B23K 1/0056 soldering by means of beams, e.g. lasers, E.B.
• CPC Class Codes: H01R 43/0214 Resistance welding H01R43/0228 takes precedence
• CPC Class Codes: H01R 43/0221 Laser welding H01R43/0228 takes precedence
• CPC Class Codes: H01R 43/0242 comprising means for controlling the temperature, e.g. making use of the curie point
• CPC Class Codes: H05K 2203/0195 Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
• CPC Class Codes: H05K 2203/0278 Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
• CPC Class Codes: H05K 2203/107 Using laser light shaping a substrate by laser ablation H05K3/0026
• CPC Class Codes: H05K 2203/111 Preheating, e.g. before soldering
• CPC Class Codes: H05K 3/3421 Leaded components
• CPC Class Codes: H05K 3/3494 Heating methods for reflowing of solder using integral heating means H05K1/0212
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A method of joining terminals by soldering is provided which allows control of increasing gas supply even in soldering performed in a gas atmosphere within a gas chamber. Utilizing a springback phenomenon occurring at a flat portion of a terminal, a solder joint of the terminal is immersed in molten solder. Then, laser soldering is performed using a gas chamber made of a material which transmits a laser beam at least in part.

Claims

1. A method of joining terminals by soldering, comprising the steps of:

(a) preparing a terminal having a flat portion and a solder joint portion, providing a substrate on which solder has previously been applied, mounting a cooling fin on said substrate, providing a laser beam source that is capable of emitting a laser beam, and providing a gas chamber that is made of a material which transmits said laser beam at least in part;

(b) pressing said solder joint portion of said terminal against said solder in order to bend said flat portion, and bringing said terminal and said substrate into said gas chamber with said solder and said solder joint of said terminal in contact with each other, and filling said gas chamber with a gas including an inert gas or a gas mixture of an inert gas and a reducing gas;

(c) heating said solder joint portion of said terminal by emitting said laser beam from said laser beam source so as to pass through the material of said gas chamber and by applying said laser beam to said solder joint portion;

(d) stopping said heating of said solder joint portion, after immersing said solder joint portion of said terminal into said solder that is molten by said heating by utilizing springback of said flat portion; and

(e) prior to said step (c), preheating said cooling fin so that said terminal is preliminarily heated via conduction through said substrate.

2. The method according to claim 1, wherein said terminal is preliminarily heated to an extent where said solder is not molten.

3. The method according to claim 1, wherein solder plating is applied to a surface of said terminal.

4. The method according to claim 1, wherein in said step (c), an optical axis of said laser beam is inclined with respect to a direction normal to a surface of said solder joint portion of said terminal.

5. The method according to claim 1, wherein in said step (b), an oxygen (O₂) gas concentration within said gas chamber is not more than 500 ppm by volume.

6. The method according to claim 1, wherein in said step (c), a diameter of irradiation of said solder joint portion of said terminal with said laser beam is approximately equal to a width of said solder joint portion.