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Semiconductor device, magnetic sensor, and magnetic sensor unit

  • US 7,265,430 B2
  • Filed: 04/28/2006
  • Issued: 09/04/2007
  • Est. Priority Date: 03/24/2004
  • Status: Active Grant
First Claim
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1. A semiconductor device, comprising:

  • a semiconductor chip, on the surface of which are formed integrated circuitry and four or more sensor elements, electrically connected thereto;

    a pad electrode, formed on the surface side of said semiconductor chip, and electrically connected to at least said integrated circuitry;

    an electrode portion, positioned on the surface side of said semiconductor chip adapted for electrically connecting said semiconductor chip to external circuitry;

    a wiring portion, electrically connecting said pad electrode to said electrode portion; and

    ,an insulating portion, formed from electrically insulating material, which covers the surface of said semiconductor chip and seals said sensor elements, wiring portion, and electrode portion, in a state which exposes, at least, said electrode portion on the surface side of said semiconductor chip;

    and whereinsaid electrode portion is placed in a position which does not overlap with said sensor elements in the thickness direction of said semiconductor chip and said four sensor elements are arranged so that each is parallel to a respective side of the semiconductor device.

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