Active liquid metal thermal spreader

• US 7,265,977 B2
• Filed: 01/18/2005
• Issued: 09/04/2007
• Est. Priority Date: 01/18/2005
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Martin, Yves, Van Kessel, Theodore G.
• Primary Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US11/037,441
• Publication Number:
  US 20060158849A1
• Time in Patent Office: 959 Days
• Field of Search: None
• US Class Current: 361/699
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The present invention is a method and apparatus for cooling a semiconductor heat source. In one embodiment a thermal spreader is provided and includes a substrate for supporting the semiconductor heat source and a heat sink coupled to the substrate. A channel is disposed between the heat sink and substrate. The channel has at least one wall defined by the heat sink. The surface area of the channel wall defined by the heat sink is about 10 to about 100 times the surface area of a bottom surface of the semiconductor heat source. A coolant, for example liquid metal, circulates within the channel.

Claims

1. A thermal spreader for cooling a semiconductor heat source, comprising:

a substrate for supporting the semiconductor heat source;

a heat sink coupled to the substrate;

a channel disposed between the heat sink and substrate, the channel having at least one wall defined by the heat sink;

a cooling device coupled to the heat sink;

a second substrate disposed beneath the heat sink; and

a second channel defined between the second substrate and the heat sink, wherein the second channel has at least one wall defined by the heat sink.

2. The thermal spreader of claim 1, further comprising:

a second coolant disposed in the second channel.

3. The thermal spreader of claim 2, wherein the second coolant comprises at least one of:

water, a water-based liquid, alcohols, glycols, ethylene glycol, sodium chloride, oils, and liquid metals.

4. A method of cooling a semiconductor heat source comprising:

providing a thermal spreader having a substrate for supporting the semiconductor heat source, a heat sink coupled to the substrate, and a channel disposed between the heat sink and substrate, the channel having at least one wall defined by the heat sink;

flowing a coolant through the channel; and

flowing a second coolant through a second channel disposed between the heat sink and a second substrate disposed beneath the heat sink, the second channel having at least one wall defined by the heat sink.

5. The method of claim 4, wherein the second coolant comprises at least one of:

water, a water-based liquid, alcohols, glycols, ethylene glycol, sodium chloride, oils, and liquid metals.