Thick porous anodic alumina films and nanowire arrays grown on a solid substrate
First Claim
1. A device comprising:
- a non-aluminum substrate;
an adhesion layer disposed over the non-aluminum substrate, wherein said adhesion layer consists essentially of a multi-layer structure of SiO2/Ti/Pt; and
a porous anodic alumina template formed on the adhesion layer of said substrate.
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Accused Products
Abstract
The presently disclosed invention provides for the fabrication of porous anodic alumina (PAA) films on a wide variety of substrates. The substrate comprises a wafer layer and may further include an adhesion layer deposited on the wafer layer. An anodic alumina template is formed on the substrate. When a rigid substrate such as Si is used, the resulting anodic alumina film is more tractable, easily grown on extensive areas in a uniform manner, and manipulated without danger of cracking. The substrate can be manipulated to obtain free-standing alumina templates of high optical quality and substantially flat surfaces PAA films can also be grown this way on patterned and non-planar surfaces. Furthermore, under certain conditions the resulting PAA is missing the barrier layer (partially or completely) and the bottom of the pores can be readily accessed electrically. The resultant film can be used as a template for forming an array of nanowires wherein the nanowires are deposited electrochemically into the pores of the template. By patterning the electrically conducting adhesion layer, pores in different areas of the template can be addressed independently, and can be filled electrochemically by different materials. Single-stage and multi-stage nanowire-based thermoelectric devices, consisting of both n-type and p-type nanowires, can be assembled on a silicon substrate by this method.
74 Citations
49 Claims
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1. A device comprising:
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a non-aluminum substrate; an adhesion layer disposed over the non-aluminum substrate, wherein said adhesion layer consists essentially of a multi-layer structure of SiO2/Ti/Pt; and a porous anodic alumina template formed on the adhesion layer of said substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34)
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35. A device comprising:
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a wafer; an adhesion layer provided on a top surface of said wafer, said adhesion layer consisting essential of a multi-layer structure of SiO2/Ti/Pt; a porous anodic alumina film disposed on said adhesion layer; and a plurality of nanowires disposed in said porous anodic alumina film. - View Dependent Claims (36, 37, 38, 39, 40, 41, 42)
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43. A multistage device comprising:
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a first stage comprising; a wafer; a first adhesion layer provided on a top surface of said wafer, said adhesion layer consisting essentially of a multi-layer structure of SiO2Ti/Pt; a porous anodic alumina film disposed on said first adhesion layer; a first plurality of nanowires disposed in said porous anodic alumina film; and at least one layer disposed on top of said porous anodic alumina film; and at least one additional stage, each of said at least one additional stage comprising; a second adhesion layer provided on a top surface of a previous stage; a second porous anodic alumina film disposed on said second adhesion layer; a second plurality of nanowires disposed in said second porous anodic alumina film; and at least one second layer disposed on top of said second porous anodic alumina film. - View Dependent Claims (44, 45, 46, 47, 48, 49)
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Specification