Hot-melt adhesive in particulate form
First Claim
Patent Images
1. A one part hot-melt adhesive composition in the form of particles and comprised of (a) one or more polymeric constituents, wherein at least one of the polymeric constituents contains one or more isocyanate groups and a polyester component, and (b) at least one tackifying resin;
- and wherein said particles remain pourable at temperatures up to 45 degrees C.
1 Assignment
0 Petitions
Accused Products
Abstract
A moisture-curing hot-melt-adhesive composition in granulate, tablet or powder form can be produced by
- a.) fusing the reactive hot-melt-adhesive composition and heating the melt, subject to exclusion of moisture,
- b.) extruding this melt through one or more dies onto a cooled surface, subject to exclusion of moisture,
- c.) cooling the granulate, subject to exclusion of moisture, whereby the composition solidifies,
- d.) removing the cooled hot-melt-adhesive granulate,
- e.) filling the granulate into moisture-tight packages, subject to exclusion of moisture.
These reactive hot-melt adhesives are pourable and free-flowing and therefore can be used with all conventional application machines for hot-melt adhesives.
-
Citations
22 Claims
-
1. A one part hot-melt adhesive composition in the form of particles and comprised of (a) one or more polymeric constituents, wherein at least one of the polymeric constituents contains one or more isocyanate groups and a polyester component, and (b) at least one tackifying resin;
- and wherein said particles remain pourable at temperatures up to 45 degrees C.
- View Dependent Claims (2, 5, 6, 7, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
-
3. A one part hot-melt adhesive composition in the form of particles and comprised of (a) one or more polymeric constituents, wherein at least one of the polymeric constituents contains one or more isocyanate groups and a polyester component, and (b) at least one tackifying resin;
- and wherein said particles remain pourable at temperatures up to 45 C. and comprise at least one material selected from the group consisting of radiation-curable polymers and monomers.
- View Dependent Claims (4)
-
8. A process for producing a one part hot-melt adhesive in the form of particles and comprised of (i) one or more polymeric constituents, wherein at least one of the polymeric constituents contains one or more isocyanate groups and a polyester component, and (ii) at least one tackifying resin;
- and wherein said particles remain pourable at temperatures up to 45 degrees C., comprising the following steps;
a) heating the polymeric constituents to a temperature between 110 degrees C. and 180 degrees C. to form a melt, subject to exclusion of moisture;
b) extruding the melt through one or more dies with a diameter from 0.5 mm to 30 mm onto a cooled surface, subject to exclusion of moisture;
c) cooling the extruded melt, subject to exclusion of moisture, whereby the extruded melt solidifies to form the one part hot-melt adhesive composition in the form of particles;
d) removing the particles from the cooled surface;
e) filling the particles into a moisture-tight package, subject to exclusion of moisture. - View Dependent Claims (9, 10, 11, 12)
- and wherein said particles remain pourable at temperatures up to 45 degrees C., comprising the following steps;
Specification