Capping of metal interconnects in integrated circuit electronic devices
First Claim
Patent Images
1. A method for forming a multilayer metal cap over a metal-filled interconnect feature in a dielectric layer for incorporation into a multilayer integrated circuit device comprising:
- depositing a first metal cap layer having a thickness between about 100 and about 300 angstroms over the metal-filled interconnect feature in a first deposition process which constitutes electroless metal deposition from a first electroless solution comprising a source of Co ions and a reducing agent;
depositing a second metal cap layer over the first metal cap layer in a second deposition process which constitutes electroless metal deposition from a second electroless solution which comprises a source of Ni ions and a reducing agent to thereby form the multilayer metal cap as a permanent component distinct from the metal-filled interconnect feature.
6 Assignments
0 Petitions
Accused Products
Abstract
A multilayer metal cap over a metal-filled interconnect feature in a dielectric layer for incorporation into a multilayer integrated circuit device, and a method for forming the cap.
62 Citations
17 Claims
-
1. A method for forming a multilayer metal cap over a metal-filled interconnect feature in a dielectric layer for incorporation into a multilayer integrated circuit device comprising:
-
depositing a first metal cap layer having a thickness between about 100 and about 300 angstroms over the metal-filled interconnect feature in a first deposition process which constitutes electroless metal deposition from a first electroless solution comprising a source of Co ions and a reducing agent; depositing a second metal cap layer over the first metal cap layer in a second deposition process which constitutes electroless metal deposition from a second electroless solution which comprises a source of Ni ions and a reducing agent to thereby form the multilayer metal cap as a permanent component distinct from the metal-filled interconnect feature. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
-
Specification