Stress release mechanism in MEMS device and method of making same

• US 7,268,463 B2
• Filed: 07/28/2005
• Issued: 09/11/2007
• Est. Priority Date: 07/28/2005
• Status: Expired due to Fees

• Current Assignee: North Star Innovations Inc. (Wi-LAN Inc.)
• Original Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Inventors: Li, Gary G., Hammond, Jonathan Hale, Koury, Jr., Daniel N.
• Primary Examiner(s): TAMAI, KARL I
• Application Number:
  US11/192,874
• Publication Number:
  US 20070024156A1
• Time in Patent Office: 775 Days
• Field of Search: 310/309, 745/041.2, 745/141.8, 745/143.2, 745/14, 74/23, 216/6, 359/295, 359/224, 385/18, 735/041.2, 735/141.8, 735/143.2, 735/14, 73/23
• US Class Current: 310/309
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 3/0072 For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 2015/0814 for translational movement of the mass, e.g. shuttle type
• CPC Class Codes: H02N 1/008 Laterally driven motors, e.g. of the comb-drive type

Abstract

MEMS devices (100) and methods for forming the devices have now been provided. In one exemplary embodiment, the MEMS device (100) comprises a substrate (106) having a surface, an electrode (128) having a first portion coupled to the substrate surface, and a second portion movably suspended above the substrate surface, and a stress-release mechanism (204) disposed on the electrode second portion, the stress-release mechanism (204) including a first slot (208) integrally formed in the electrode. In another exemplary embodiment, the substrate (106) includes an anchor (134, 136) and the stress-release mechanism 222 is formed adjacent the anchor (134, 136).

Claims

1. A MEMS device comprising:

a substrate having a surface;

a fixed electrode at least partially anchored to the substrate surface, said fixed electrode having a first side, a second side, and a midline intermediate the first side and the second side;

a movable electrode movably suspended above the substrate surface; and

a stress-release mechanism disposed on the fixed electrode including a first slot extending through the first side, past the midline, and partially toward the second side.

2. The MEMS device of claim 1, wherein the stress-release mechanism comprises a second slot integrally formed in the fixed electrode, the second slot extending through the second side, past the midline, and partially toward the first side.

3. The MEMS device of claim 2, wherein the first slot and the second slot cooperate to define an S-shaped portion of the fixed electrode.

4. The MEMS device of claim 1, wherein:

the substrate comprises an insulating layer and an active layer disposed over the insulating layer; and

the fixed electrode is formed in the active layer.

5. A method of forming a micro-electromechanical (“

MEMS”

) device from a substrate comprising an insulating layer and an active layer overlying the insulating layer, the method comprising the steps of;

forming a protective layer over the active layer in a pattern, the pattern having at least a first electrode section having a corner, a second electrode section adjacent the first electrode section and having an corner disposed diagonally from the first electrode section corner, and a strip connecting the first and second electrode section corners, the strip defined by first and second slots extending into the pattern; and

removing material from portions of the active layer and the insulating layer over which the protective layer is not formed to thereby form an electrode having a slot formed therein.

6. The method of claim 5, wherein the first electrode section has a side and the second electrode section has a side substantially parallel to the first electrode section side and at least a portion of the strip is substantially parallel to the first and second electrode section sides.

7. The method of claim 5, wherein the step of forming comprises placing a shadowmask having an outline of the pattern over the active layer.

8. The method of claim 5, wherein the step of forming comprises:

depositing the protective material over the surface of the active layer; and

etching the pattern into the deposited protective material.

9. The method of claim 5, further comprising etching a portion of the insulating layer beneath the first electrode portion to thereby release at least a portion of the first electrode from the substrate.