Low-profile USB device

• US 7,269,004 B1
• Filed: 04/21/2005
• Issued: 09/11/2007
• Est. Priority Date: 04/21/2005
• Status: Expired due to Fees

• Current Assignee: Super Talent Technology, Corporation
• Original Assignee: Super Talent Electronics, Inc.
• Inventors: Ni, Jim, Chiou, Ren-Kang
• Primary Examiner(s): Dinh; Tuan T.
• Assistant Examiner(s): Bui; Hung S.
• Application Number:
  US11/112,501
• Time in Patent Office: 873 Days
• Field of Search: 361/737, 361/727, 361683-686, 361/715, 361/752, 439/607, 439/374, 439/79, 439/379, 439/610, 439/680
• US Class Current: 361/679.41
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H05K 5/0278 of USB type details relating to connectors H01R27/00

Abstract

A low-profile Universal-Serial-Bus (USB) device includes a PCBA in which all of the ICs are formed on a side of a PCB opposite to the metal contacts. The ICs include, for example, a USB controller chip and flash memory chip or communication chip. A housing is attached over the ICs and extends a minimum height above the metal contacts.

Claims

1. A low-profile Universal-Serial-Bus (USB) device comprising:

a printed circuit board assembly (PCBA) including;

a printed circuit board (PCB) including a relatively wide PCB handle section and a relatively narrow PCB plug section, the PCB having opposing first and second surfaces,

a plurality of metal contacts disposed on the first surface of the PCB plug section,

at least one integrated circuit (IC) mounted on the second surface of the PCB, the IC including means for processing USB signals, and

a plurality of conductive traces mounted on the PCB, each conductive trace extending between an associated metal contact and the IC; and

a housing attached to the PCBA and including a cover plate extending over both the PCB handle section and the PCB plug section,

wherein the cover plate includes a planar surface that is parallel to the PCB,

wherein a first thickness measured between the first surface of the PCB and the planar surface adjacent to the metal contacts is substantially equal to a second thickness between the first surface of the PCB and the planar surface adjacent to the IC, and

wherein substantially all of the housing is located between the first surface and the cover plate.

2. The low-profile USB device of claim 1, wherein the PCBA comprises a lead-free structure.

3. The low-profile USB device of claim 1, wherein the housing is arranged such that the entire first surface of the PCB handle section is exposed and forms at least part of an upper surface of the USB device.

4. The low-profile USB device of claim 1, wherein the housing further comprises a peripheral wall extending around a peripheral edge of the PCB such that an upper edge of the peripheral wall covers the peripheral edge of the PCB, and an upper edge of the peripheral wall is substantially coplanar with the first surface of the PCB.

5. The low-profile USB device of claim 4, wherein the housing comprises a molded material formed on the ICs and the second surface of the PCB.

6. The low-profile USB device of claim 4, wherein the cover plate of the housing is secured to said at least one IC by an adhesive layer.

7. The low-profile USB device of claim 4, further comprising a light-producing device mounted on the second surface of the PCB, wherein a peripheral wall of the housing defines an opening aligned such that the light-producing device is visible through the opening.

8. The low-profile USB device of claim 4, wherein the peripheral wall includes end rail sections extending above the first surface of the PCB.

9. The low-profile USB device of claim 1, wherein the PCB further comprises metal dividers formed on the first surface of the PCB, each of the metal dividers being located between an adjacent pair of the metal contacts.

10. The low-profile USB device of claim 1, wherein the cover plate defines one or more locking depressions.

11. The low-profile USB device of claim 1, wherein outer surfaces of the peripheral wall of the housing is aligned with a peripheral edge of the PCB.

12. The low-profile USB device of claim 1, wherein the housing further comprises:

a thin plastic plate mounted on the first surface of the PCB handle section.

13. The low-profile USB device of claim 12, wherein the housing further comprises:

a peripheral wall extending around a peripheral edge of the PCB, the peripheral wall having a lower edge integrally molded to a peripheral edge of the cover plate; and

a thin plastic plate integrally molded to an upper edge of the peripheral wall, the thin plastic plate extending over the first surface of the PCB handle section.

14. The low-profile USB device of claim 13, wherein the housing comprises a molded material formed on the ICs and the second surface of the PCB.

15. The low-profile USB device of claim 13, wherein the peripheral wall includes a peripheral shelf, and wherein the PCBA is mounted on housing such that a peripheral edge of the PCB is supported by the peripheral shelf.

16. The low-profile USB device of claim 1, wherein the housing comprises:

a first housing portion including the cover plate and a first peripheral wall extending perpendicular to the cover plate;

a plurality of tabs formed on an outside surface of the first peripheral wall;

a second housing portion including a top plate and a second peripheral wall extending perpendicular to the top plate, wherein an inside surface of the second peripheral wall defines a plurality of slots arranged such that, when the second housing portion is mounted over the first housing portion, each of the tabs formed on the first peripheral wall engage a corresponding slot.

17. The low-profile USB device of claim 16, further comprising a first adhesive layer disposed between the PCBA and the cover plate, and a second adhesive layer disposed between the first surface of the PCB and the top plate.

18. The low-profile USB device of claim 1, wherein the housing comprises:

a first housing portion including the cover plate;

a second housing portion including a peripheral wall having a handle wall section and a plug wall section, the second housing portion also including a top plate mounted on the handle wall section, wherein a window is defined by the plug wall section,

wherein the second housing portion is mounted onto the first housing portion such that a peripheral edge of the cover plate is ultrasonically welded onto the peripheral wall, such that the PCB handle portion is positioned between a first portion of the cover plate, and such that the metal contacts are exposed through the window.

19. The low-profile USB device of claim 1, wherein the housing defines at least one hole for receiving a key chain therein.

20. The low-profile USB device of claim 1, wherein the ICs include a wireless communication transmission device.

21. A method for manufacturing (Universal Serial Bus) devices comprising:

forming a first housing portion including a first cover plate and a peripheral wall extending from the first cover plate and defining a plurality of peripheral slots, a second housing portion including a second peripheral wall having a plurality of tabs extending from the peripheral wall, and a PCBA; and

snap-coupling the second housing portion to the first housing portion such that each of the tabs is received inside a corresponding slot of the plurality of peripheral slots, and such that the PCBA is sandwiched between first and second housing portions with a first adhesive layer between a first surface of the PCBA and the first cover plate and a second adhesive layer between a second surface of the PCBA and the second cover plate.